LCMXO2-2000HC-6MG132C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 104 75776 2112 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 74 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSPBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 104 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-2000HC-6MG132C – MachXO2 FPGA, 132‑LFBGA, 104 I/Os
The LCMXO2-2000HC-6MG132C is a MachXO2 field programmable gate array (FPGA) in a 132‑ball LFBGA (CSPBGA) package. It provides a flexible low-power logic fabric with 2,112 logic elements and 104 general-purpose I/Os, suitable for control, glue logic and interface tasks in commercial‑grade embedded systems.
This device integrates on-chip RAM (total 75,776 bits), single‑chip nonvolatile configuration options from the MachXO2 family, and a wide supply range, delivering integration and fast time-to-market for designs that require reconfigurable logic and embedded memory within a compact surface‑mount package.
Key Features
- Logic Capacity — 2,112 logic elements (cells) provide combinational and sequential resources for glue logic, protocol bridging and moderate-density control functions.
- On‑Chip Memory — Total RAM bits: 75,776, offering local storage for FIFOs, packet buffering and small state machines.
- I/O and Interface Flexibility — 104 I/Os in a 132‑LFBGA package allow abundant connectivity for peripheral interfaces and board-level signals.
- Power and Supply Range — Operates with a supply voltage range of 2.375 V to 3.465 V, supporting multiple system power domains.
- Nonvolatile Configuration and Family Features — MachXO2 family includes on‑chip user flash memory (family support up to 256 kbits), instant‑on single‑chip operation, and in‑field reconfiguration options as described in the MachXO2 family data.
- Low Power Design — MachXO2 family architectures are implemented in an advanced low‑power process with family features that include very low standby power modes.
- Clocking and Timing — Family‑level support includes multiple primary clocks and analog PLLs for flexible clocking (see MachXO2 family datasheet for details).
- Package and Mounting — 132‑CSPBGA (8 mm × 8 mm) surface‑mount package, RoHS compliant and intended for commercial temperature operation (0 °C to 85 °C).
Typical Applications
- Board-level glue logic — Implement bus bridging, protocol conversion and peripheral arbitration using the device’s logic elements and abundant I/Os.
- System control and peripheral management — Use on‑chip RAM and logic to manage timers, counters and status machines in embedded control applications.
- Display and source‑synchronous I/O interfaces — MachXO2 family features for pre‑engineered source synchronous I/O and DDR registers support display and high‑speed I/O interfacing needs.
- Field-updatable logic — Take advantage of MachXO2 family TransFR reconfiguration and background programming capabilities for in‑field updates and iterative development.
Unique Advantages
- Compact, connectable package: 132‑ball CSPBGA provides a small footprint with 104 I/Os to maximize board connectivity in size‑constrained designs.
- Balanced integration: 2,112 logic elements combined with approximately 75.8 kbits of on‑chip RAM reduces external component count for mid‑density functions.
- Flexible supply support: Wide operating supply range (2.375 V–3.465 V) eases integration with varied system power rails.
- Instant‑on and reconfigurability: MachXO2 family nonvolatile and in‑field configuration features enable single‑chip instant‑on designs and live updates without external configuration PROMs.
- Commercial temperature rating: Specified for 0 °C to 85 °C operation to match mainstream embedded and consumer product requirements.
- RoHS compliant: Meets RoHS requirements for environmentally conscious designs and manufacturing.
Why Choose LCMXO2-2000HC-6MG132C?
The LCMXO2-2000HC-6MG132C brings MachXO2 family integration to a compact 132‑LFBGA package, offering 2,112 logic elements, substantial on‑chip RAM and 104 I/Os for versatile mid‑density applications. Its combination of nonvolatile configuration options, low‑power family attributes and abundant I/O makes it a practical choice for designers looking to consolidate glue logic, interface control and system management functions without increasing BOM complexity.
Ideal for commercial embedded products, development platforms and interface bridging tasks, this device pairs reconfigurable logic with family‑level features such as programmable I/O standards, multi‑clock capability and in‑field reconfiguration to support evolving system requirements and product lifecycles.
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