LCMXO2-2000HC-6BG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA |
|---|---|
| Quantity | 254 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-2000HC-6BG256I – MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA
The LCMXO2-2000HC-6BG256I is a MachXO2 family FPGA offering 2,112 logic elements, 206 I/Os and approximately 75.8 kbits of on-chip RAM in a 256-ball LFBGA package. It is an industrial-grade, surface-mount device with an extended operating range and flexible voltage supply.
Designed for systems that require programmable logic, extensive I/O, and non-volatile configuration options, this device combines mid-density logic resources with family-level capabilities such as on-chip user flash, flexible I/O signaling and low-power operation.
Key Features
- Logic Capacity Provides 2,112 logic elements suitable for mid-density programmable logic and glue‑logic implementations.
- On-chip Memory Total RAM of 75,776 bits (approximately 75.8 kbits) for distributed memory and small data buffers.
- I/O Density and Flexibility 206 I/Os with programmable buffer support for a wide range of interfaces, including low-swing differential and single‑ended signaling (family-level sysIO support).
- Power and Voltage Single-supply operation across 2.375 V to 3.465 V, with MachXO2 family low‑power architecture and standby modes available.
- Package and Mounting 256-ball LFBGA (supplier package: 256-CABGA 14×14), surface-mount mounting for compact board integration.
- Industrial Grade Temperature Rated for operation from −40 °C to 100 °C for use in industrial temperature environments.
- Non-volatile Configuration MachXO2 family supports on-chip user flash memory and instant-on, enabling single-chip, reconfigurable designs and background programming options.
- Clocking and PLLs (family-level) Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs for fractional‑N frequency synthesis.
- System Integration Features (family-level) Includes hardened functions such as SPI, I²C and timer/counter primitives, plus boundary-scan and in-system programming support.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Programmable logic and extended temperature range support control, monitoring and I/O aggregation tasks in industrial systems.
- Interface Bridging and Glue Logic Mid-density logic and abundant I/Os make the device suitable for protocol translation, bus bridging and system glue functions.
- Display and Memory Interfaces Family-level pre-engineered source‑synchronous I/O, DDR registers in I/O cells and display gearing support make it appropriate for display timing and memory interface roles.
- Embedded System Configuration On-chip user flash and instant-on reconfiguration provide non-volatile programmability and in-field update capability for embedded subsystems.
Unique Advantages
- Balanced Logic and I/O Density: 2,112 logic elements combined with 206 I/Os deliver a practical balance of compute and connectivity for mid-size designs.
- Non-volatile, Reconfigurable: On-chip user flash enables single-chip configuration storage and in-field updates without external configuration ROMs.
- Flexible I/O Signaling: Programmable sysIO buffer options (family-level) provide support for a wide range of interface standards, reducing external level‑conversion components.
- Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsher operating environments.
- Compact Package: 256-ball LFBGA (14×14) offers a small footprint surface-mount option for space-constrained PCBs.
- Integrated System Features: Hardened SPI, I²C and timers simplify common control and configuration tasks, shrinking BOM and development time.
Why Choose LCMXO2-2000HC-6BG256I?
This MachXO2 device is positioned for designs that require solid mid-range programmable logic, a high number of I/Os, and on-chip non-volatile configuration in an industrial temperature package. With 2,112 logic elements, approximately 75.8 kbits of RAM and 206 I/Os in a compact 256-ball LFBGA, it is suited to system glue logic, interface bridging and embedded control applications where reconfigurability and I/O flexibility matter.
Family-level features such as instant-on, programmable low‑swing differential I/Os, flexible clocking and on-chip flash provide a practical platform for scalable designs that benefit from in-field updates and integrated system functions.
If you would like pricing, availability or to request a quote for LCMXO2-2000HC-6BG256I, please submit a request or RFQ to initiate the procurement process.

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