LCMXO2-2000HC-6BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA

Quantity 254 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000HC-6BG256I – MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA

The LCMXO2-2000HC-6BG256I is a MachXO2 family FPGA offering 2,112 logic elements, 206 I/Os and approximately 75.8 kbits of on-chip RAM in a 256-ball LFBGA package. It is an industrial-grade, surface-mount device with an extended operating range and flexible voltage supply.

Designed for systems that require programmable logic, extensive I/O, and non-volatile configuration options, this device combines mid-density logic resources with family-level capabilities such as on-chip user flash, flexible I/O signaling and low-power operation.

Key Features

  • Logic Capacity  Provides 2,112 logic elements suitable for mid-density programmable logic and glue‑logic implementations.
  • On-chip Memory  Total RAM of 75,776 bits (approximately 75.8 kbits) for distributed memory and small data buffers.
  • I/O Density and Flexibility  206 I/Os with programmable buffer support for a wide range of interfaces, including low-swing differential and single‑ended signaling (family-level sysIO support).
  • Power and Voltage  Single-supply operation across 2.375 V to 3.465 V, with MachXO2 family low‑power architecture and standby modes available.
  • Package and Mounting  256-ball LFBGA (supplier package: 256-CABGA 14×14), surface-mount mounting for compact board integration.
  • Industrial Grade Temperature  Rated for operation from −40 °C to 100 °C for use in industrial temperature environments.
  • Non-volatile Configuration  MachXO2 family supports on-chip user flash memory and instant-on, enabling single-chip, reconfigurable designs and background programming options.
  • Clocking and PLLs (family-level)  Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs for fractional‑N frequency synthesis.
  • System Integration Features (family-level)  Includes hardened functions such as SPI, I²C and timer/counter primitives, plus boundary-scan and in-system programming support.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Programmable logic and extended temperature range support control, monitoring and I/O aggregation tasks in industrial systems.
  • Interface Bridging and Glue Logic  Mid-density logic and abundant I/Os make the device suitable for protocol translation, bus bridging and system glue functions.
  • Display and Memory Interfaces  Family-level pre-engineered source‑synchronous I/O, DDR registers in I/O cells and display gearing support make it appropriate for display timing and memory interface roles.
  • Embedded System Configuration  On-chip user flash and instant-on reconfiguration provide non-volatile programmability and in-field update capability for embedded subsystems.

Unique Advantages

  • Balanced Logic and I/O Density: 2,112 logic elements combined with 206 I/Os deliver a practical balance of compute and connectivity for mid-size designs.
  • Non-volatile, Reconfigurable: On-chip user flash enables single-chip configuration storage and in-field updates without external configuration ROMs.
  • Flexible I/O Signaling: Programmable sysIO buffer options (family-level) provide support for a wide range of interface standards, reducing external level‑conversion components.
  • Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsher operating environments.
  • Compact Package: 256-ball LFBGA (14×14) offers a small footprint surface-mount option for space-constrained PCBs.
  • Integrated System Features: Hardened SPI, I²C and timers simplify common control and configuration tasks, shrinking BOM and development time.

Why Choose LCMXO2-2000HC-6BG256I?

This MachXO2 device is positioned for designs that require solid mid-range programmable logic, a high number of I/Os, and on-chip non-volatile configuration in an industrial temperature package. With 2,112 logic elements, approximately 75.8 kbits of RAM and 206 I/Os in a compact 256-ball LFBGA, it is suited to system glue logic, interface bridging and embedded control applications where reconfigurability and I/O flexibility matter.

Family-level features such as instant-on, programmable low‑swing differential I/Os, flexible clocking and on-chip flash provide a practical platform for scalable designs that benefit from in-field updates and integrated system functions.

If you would like pricing, availability or to request a quote for LCMXO2-2000HC-6BG256I, please submit a request or RFQ to initiate the procurement process.

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