XA7A15T-2CSG324I

The XA7A15T-2CSG324I is an Artix‑7 XA Field Programmable Gate Array (FPGA) from AMD. It provides a compact, surface‑mount FPGA solution with a balance of logic capacity, on‑chip memory, and I/O density for embedded and vehicle‑grade electronics.

With 16,640 logic elements, approximately 0.92 Mbits of embedded RAM, 210 user I/O pins, AEC‑Q100 qualification and an extended operating temperature range, this device targets designs that require reliable operation across demanding temperature and voltage conditions.

Key Features

• Logic Capacity — 16,640 logic elements and 1,300 configurable logic blocks (CLBs) provide substantial programmable logic resources for custom digital functions.
• Embedded Memory — Approximately 0.92 Mbits (921,600 bits) of on‑chip RAM to support buffering, state machines and small data stores without external memory.
• I/O Density — 210 user I/O pins support a wide range of peripheral interfaces and signal connections in a single device footprint.
• Power Supply — Core voltage range from 0.950 V to 1.05 V, enabling predictable power provisioning for the FPGA core.
• Automotive Qualification & Temperature Range — AEC‑Q100 qualification and an operating temperature range from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Package & Mounting — 324‑LFBGA (324‑CSPBGA, 15×15) package with surface‑mount mounting type for compact PCB implementations.
• Compliance — RoHS‑compliant construction to meet common environmental and regulatory requirements.

Typical Applications

• Automotive electronics — AEC‑Q100 qualification and −40 °C to 100 °C operating range suit electronic control modules and other in‑vehicle systems that require rugged, temperature‑tolerant logic.
• Custom embedded designs — The combination of 16,640 logic elements and ~0.92 Mbits of embedded RAM supports application‑specific processing and control logic in compact systems.
• I/O‑rich interfacing — With 210 I/O pins, the device accommodates designs requiring multiple peripheral connections or mixed signal interfacing on a single FPGA.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 qualification signals suitability for automotive development flows and component selection criteria.
• Balanced resource set: 16,640 logic elements paired with nearly 1 Mbit of on‑chip RAM provides a balanced mix of logic and memory for many embedded functions without immediate external memory needs.
• High I/O count in a compact package: 210 I/O pins in a 324‑LFBGA (15×15) package allow dense connectivity while maintaining a small PCB footprint.
• Extended temperature and voltage operating window: Operation from −40 °C to 100 °C and a 0.950–1.05 V core supply range supports robust system power and thermal design margins.
• Surface‑mount package for modern assembly: CSPBGA mounting style enables automated placement and reflow assembly for volume production.

Why Choose XA7A15T-2CSG324I?

The XA7A15T-2CSG324I positions itself as a compact, automotive‑qualified FPGA option that combines a substantial logic fabric, embedded memory, and a high I/O count in a small CSPBGA package. Its AEC‑Q100 qualification and extended temperature range make it a practical choice for designs where environmental robustness and predictable electrical characteristics are required.

This device is well suited to engineers and procurement teams seeking a programmable logic device that delivers scalability in logic and memory resources, straightforward board‑level integration via a 324‑LFBGA package, and compliance credentials for regulated applications.

Request a quote or contact sales to discuss availability, lead times and volume pricing for the XA7A15T-2CSG324I.