XA7A25T-1CSG325I
| Part Description |
Artix-7 XA Field Programmable Gate Array (FPGA) IC 150 1658880 23360 324-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,091 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CSPBGA (15x15) | Grade | Automotive | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA, CSPBGA | Number of I/O | 150 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1825 | Number of Logic Elements/Cells | 23360 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 1658880 |
Overview of XA7A25T-1CSG325I – Artix-7 XA Field Programmable Gate Array (FPGA), 23,360 logic elements, 150 I/O, 324-CSPBGA
The XA7A25T-1CSG325I is an Artix-7 XA Field Programmable Gate Array (FPGA) IC from AMD designed for applications that require programmable logic, on-chip memory and a compact BGA footprint. It combines mid-range logic density and embedded RAM with an automotive-grade qualification for use in environments that demand component-level reliability.
With a core supply range tailored for modern digital designs and a wide operating temperature range, this device targets automotive and embedded designs that need a qualified, surface-mount FPGA solution in a space-constrained package.
Key Features
- Core Logic — Provides 23,360 logic elements suitable for mid-range programmable logic implementations.
- Embedded Memory — Approximately 1.66 Mbits of on-chip RAM (1,658,880 total bits) for buffering, state storage and data processing tasks.
- I/O Capacity — 150 user I/O pins to support multiple external interfaces and sensor connections.
- Power — Core voltage supply range from 950 mV to 1.05 V to match modern low-voltage FPGA power domains.
- Package & Mounting — 324-CSPBGA (15×15) / 324-LFBGA package in a surface-mount form factor for compact board integration.
- Automotive Qualification — Automotive grade device with AEC-Q100 qualification for applications requiring automotive-qualified components.
- Temperature Range — Rated for operation from −40°C to 100°C to support challenging thermal environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Automotive systems — Automotive-grade qualification makes this FPGA suitable for programmable logic functions in vehicle electronics where component-level qualification is required.
- Embedded control and signal processing — On-chip RAM and substantial logic capacity enable custom control algorithms, data buffering and signal handling in embedded designs.
- Space-constrained electronic assemblies — The 324-CSPBGA (15×15) surface-mount package provides a high-pin-count solution for designs with limited PCB area.
Unique Advantages
- Automotive-qualified device: AEC-Q100 qualification and automotive grade designation allow use in applications that require qualified components.
- Significant logic capacity: 23,360 logic elements deliver the density needed for mid-range programmable designs without external logic devices.
- On-chip RAM: Approximately 1.66 Mbits of embedded memory reduces dependence on external memory for buffering and state storage.
- High I/O count: 150 I/O pins give flexibility for interfacing to sensors, actuators and other system peripherals.
- Compact BGA footprint: 324-CSPBGA (15×15) package enables a high-pin-count solution in a small board area.
- Wide operating range: −40°C to 100°C rating and RoHS compliance support deployment in demanding environments with environmental restrictions.
Why Choose XA7A25T-1CSG325I?
The XA7A25T-1CSG325I positions itself as a compact, automotive-qualified FPGA option that balances logic density, embedded memory and I/O capability in a surface-mount BGA package. Its specification set—including AEC-Q100 qualification, a core voltage range of 950 mV to 1.05 V and an extended operating temperature range—makes it a practical choice for engineers developing automotive and embedded systems that require qualified programmable logic in constrained footprints.
Manufactured by AMD, this device is suited for designs where mid-range programmable logic, on-chip RAM and a high I/O count are needed together with automotive-grade qualification and RoHS compliance, delivering a combination of integration and reliability for long-term product needs.
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