XA7A25T-2CPG238I

The XA7A25T-2CPG238I is an Artix-7 XA field programmable gate array (FPGA) from AMD supplied in a 238‑LFBGA/CSPBGA package. It delivers reconfigurable logic capacity and on-chip memory in a surface-mount BGA suited for automotive-grade applications.

Key device attributes include 23,360 logic elements, approximately 1.66 Mbits of embedded memory, 150 I/O pins, a core supply range of 0.95–1.05 V, and an operating temperature range of -40°C to 100°C. The device is AEC‑Q100 qualified and RoHS compliant.

Key Features

• Logic Capacity — 23,360 logic elements for implementing complex programmable logic functions and finite-state control.
• Embedded Memory — Approximately 1.66 Mbits of on-chip RAM to support buffering, state storage, and small data working sets without external memory.
• I/O — 150 user I/Os to interface with sensors, actuators, communication transceivers, and other system peripherals.
• Power Supply — Core voltage supply range of 0.95 V to 1.05 V for defined power-domain integration.
• Package & Mounting — 238‑LFBGA/CSPBGA in a 238‑CSBGA (10×10) supplier package; designed for surface-mount PCB assembly.
• Automotive Qualification & Temperature Range — AEC‑Q100 qualified with an operating range of -40°C to 100°C for automotive system environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Automotive Electronic Control — AEC‑Q100 qualification and the device’s operating temperature range make it suitable for reconfigurable logic in automotive control systems.
• In-vehicle Sensor & Interface Processing — 150 I/O pins and on-chip memory support interfacing and pre-processing of sensor data within vehicle subsystems.
• Embedded System Integration — Logic capacity and embedded RAM enable integration of custom control, protocol bridging, and state machines for embedded product designs.

Unique Advantages

• Automotive-qualified component: AEC‑Q100 qualification provides a known qualification status for automotive applications.
• High logic and memory integration: 23,360 logic elements combined with approximately 1.66 Mbits of on-chip RAM reduces dependence on external logic and memory components.
• Generous I/O count: 150 I/Os enable flexible connectivity to a wide range of peripherals and subsystems.
• Compact surface-mount package: 238‑LFBGA/CSPBGA (238‑CSBGA 10×10) supports dense PCB layouts while maintaining a standard BGA footprint.
• Designed for automotive thermal environments: Specified operation from -40°C to 100°C to meet temperature demands common in vehicle electronics.
• Regulatory compliance: RoHS status supports lead-free assembly and environmental compliance requirements.

Why Choose XA7A25T-2CPG238I?

The XA7A25T-2CPG238I positions itself as a reconfigurable, automotive-grade FPGA option providing a balanced combination of logic density, embedded memory, and I/O capacity in a compact BGA package. Its AEC‑Q100 qualification, broad operating temperature window, and defined supply voltage range make it suitable for designs that require qualified components and deterministic electrical requirements.

This device is well suited to engineers and procurement teams designing automotive and embedded systems that benefit from on-chip programmability, reduced external component count, and a manufacturer-backed Artix-7 XA FPGA product family presence.

Request a quote or submit a procurement inquiry to get pricing and availability for XA7A25T-2CPG238I.