XA7A25T-1CPG238Q

The XA7A25T-1CPG238Q is an Artix-7 field programmable gate array (FPGA) from AMD designed for space- and power-efficient embedded logic implementations. It delivers 23,360 logic elements, approximately 1.66 Mbits of on-chip RAM, and up to 150 I/O in a compact 238-ball CSP/LFBGA package.

With a supply voltage window of 0.95 V to 1.05 V and an operating temperature range from −40°C to 125°C, this AEC-Q100 qualified, automotive-grade FPGA targets designs that require robust thermal performance and a high degree of integration in surface-mount form factors.

Key Features

• Core Logic — 23,360 logic elements for implementing custom digital functions and hardware accelerators.
• Embedded Memory — Approximately 1.66 Mbits of on-chip RAM to support buffering, FIFOs, and small lookup tables without external memory.
• I/O Capacity — 150 user I/O pins to support multiple interfaces and sensor/actuator connectivity.
• Power Supply — Operates from a core supply range of 0.95 V to 1.05 V for predictable power planning.
• Package & Mounting — Surface-mount 238-ball package (238-LFBGA / 238-CSBGA 10×10) optimized for compact board layouts.
• Temperature & Qualification — Rated for −40°C to 125°C and AEC-Q100 qualified for automotive-grade deployments.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing preferences.

Typical Applications

• Automotive systems — AEC-Q100 qualification and a −40°C to 125°C operating range make this FPGA suitable for in-vehicle control, sensor aggregation, and domain-specific logic in automotive electronics.
• Compact embedded modules — The 238-ball CSP/LFBGA surface-mount package and high logic density enable integration into space-constrained assemblies.
• High-density I/O aggregation — Up to 150 I/O pins support multi-sensor interfaces, communications endpoints, and mixed-signal bridging on a single device.
• On-chip buffering and control logic — Approximately 1.66 Mbits of embedded RAM supports local data buffering, small FIFOs, and control-state storage without requiring external memory.

Unique Advantages

• High logic density: 23,360 logic elements consolidate complex designs into a single device, reducing bill-of-materials and board complexity.
• Automotive qualification: AEC-Q100 certification and wide temperature range support reliable operation in automotive-grade applications.
• Compact packaging: 238-ball CSP/LFBGA surface-mount package enables small-form-factor designs while preserving connectivity with 150 I/O pins.
• On-chip RAM availability: Approximately 1.66 Mbits of embedded memory reduces dependence on external RAM for buffering and control functions.
• Predictable power envelope: Narrow core supply window (0.95 V–1.05 V) simplifies power-supply design and thermal planning.

Why Choose XA7A25T-1CPG238Q?

The XA7A25T-1CPG238Q combines substantial logic capacity, on-chip memory, and a large I/O complement in a compact, surface-mount package—making it well-suited for embedded applications that require integration and thermal robustness. Its AEC-Q100 automotive qualification and −40°C to 125°C rating provide confidence for deployments where environmental margin and reliability matter.

This device is appropriate for engineers designing compact, high-functionality systems that need a balance of logic density, local memory, and broad I/O in an automotive-grade FPGA platform from AMD.

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