XA7A35T-2CSG324I

IC FPGA 210 I/O 324CSBGA
Part Description

Artix-7 XA Field Programmable Gate Array (FPGA) IC 210 1843200 33280 324-LFBGA, CSPBGA

Quantity 523 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeAutomotiveOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O210Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2600Number of Logic Elements/Cells33280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits1843200

Overview of XA7A35T-2CSG324I – Artix-7 XA Field Programmable Gate Array (FPGA) IC

The XA7A35T-2CSG324I is an Artix-7 XA family FPGA from AMD, delivered in a 324-pin CSPBGA surface-mount package. It combines a compact package and low-voltage core with a substantial logic and memory resource set tailored for embedded and automotive-grade designs.

With 33,280 logic elements, approximately 1.84 Mbits of embedded memory and up to 210 I/O, this device targets designs that need on-chip integration, deterministic operating range, and automotive qualification for robust deployment.

Key Features

  • Core Logic  33,280 logic elements provide a sizable fabric for custom digital logic, state machines, and protocol implementations.
  • Embedded Memory  Approximately 1.84 Mbits of on-chip RAM support buffering, FIFOs, and data processing without external memory.
  • I/O Capacity  Up to 210 user I/O pins enable multiple interfaces and mixed-signal connectivity directly from the FPGA package.
  • Power  Core supply range from 950 mV to 1.05 V supports low-voltage operation optimized for the device family.
  • Package & Mounting  Available in a 324-LFBGA / 324-CSPBGA (15×15) surface-mount package for compact board layouts and automated assembly.
  • Automotive Qualification & Reliability  AEC-Q100 qualification and automotive grade designation make the device suitable for automotive system integration where qualification is required.
  • Temperature Range  Rated for operation from −40 °C to 100 °C to meet a broad range of environmental requirements.
  • Environmental Compliance  RoHS compliant for designs requiring lead-free and environmentally conscious components.

Typical Applications

  • Automotive Systems  Use in automotive control and signal processing modules where AEC-Q100 qualification and extended temperature range are required.
  • Embedded Control & Signal Processing  Implement real-time processing, protocol bridging, and custom control logic with available logic and on-chip RAM.
  • Interface Aggregation  Consolidate multiple I/O interfaces and bus logic into a single compact package for space-constrained systems.

Unique Advantages

  • Automotive-Qualified Silicon: AEC-Q100 qualification and automotive grade designation reduce validation burden for vehicle-level designs.
  • Substantial On-Chip Resources: 33,280 logic elements and approximately 1.84 Mbits of embedded memory enable integrated digital designs without immediate reliance on external memory.
  • Compact, Assembly-Friendly Package: The 324-CSPBGA (15×15) surface-mount package supports compact board layouts and standard SMT assembly processes.
  • Wide Operating Temperature: −40 °C to 100 °C rating supports deployment across harsh thermal environments.
  • Low-Voltage Core Operation: 950 mV to 1.05 V supply range supports lower-power system designs and consistent core operation within the device family.
  • Regulatory Compliance: RoHS compliance aligns with modern environmental and manufacturing requirements.

Why Choose XA7A35T-2CSG324I?

The XA7A35T-2CSG324I positions itself as a compact, automotive-qualified FPGA option that balances on-chip logic density, embedded memory, and a wide operating temperature range. It is suited for engineers designing automotive or robust embedded systems that require a qualified, surface-mount FPGA with ample I/O and memory resources.

Choosing this part provides a clear path to integration—minimizing external components while leveraging a qualified device footprint that supports production-level assembly and environmental compliance.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for XA7A35T-2CSG324I. Our team will respond with details to support your design and procurement needs.

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