XA7A35T-2CSG324I
| Part Description |
Artix-7 XA Field Programmable Gate Array (FPGA) IC 210 1843200 33280 324-LFBGA, CSPBGA |
|---|---|
| Quantity | 523 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CSPBGA (15x15) | Grade | Automotive | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA, CSPBGA | Number of I/O | 210 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2600 | Number of Logic Elements/Cells | 33280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 1843200 |
Overview of XA7A35T-2CSG324I – Artix-7 XA Field Programmable Gate Array (FPGA) IC
The XA7A35T-2CSG324I is an Artix-7 XA family FPGA from AMD, delivered in a 324-pin CSPBGA surface-mount package. It combines a compact package and low-voltage core with a substantial logic and memory resource set tailored for embedded and automotive-grade designs.
With 33,280 logic elements, approximately 1.84 Mbits of embedded memory and up to 210 I/O, this device targets designs that need on-chip integration, deterministic operating range, and automotive qualification for robust deployment.
Key Features
- Core Logic 33,280 logic elements provide a sizable fabric for custom digital logic, state machines, and protocol implementations.
- Embedded Memory Approximately 1.84 Mbits of on-chip RAM support buffering, FIFOs, and data processing without external memory.
- I/O Capacity Up to 210 user I/O pins enable multiple interfaces and mixed-signal connectivity directly from the FPGA package.
- Power Core supply range from 950 mV to 1.05 V supports low-voltage operation optimized for the device family.
- Package & Mounting Available in a 324-LFBGA / 324-CSPBGA (15×15) surface-mount package for compact board layouts and automated assembly.
- Automotive Qualification & Reliability AEC-Q100 qualification and automotive grade designation make the device suitable for automotive system integration where qualification is required.
- Temperature Range Rated for operation from −40 °C to 100 °C to meet a broad range of environmental requirements.
- Environmental Compliance RoHS compliant for designs requiring lead-free and environmentally conscious components.
Typical Applications
- Automotive Systems Use in automotive control and signal processing modules where AEC-Q100 qualification and extended temperature range are required.
- Embedded Control & Signal Processing Implement real-time processing, protocol bridging, and custom control logic with available logic and on-chip RAM.
- Interface Aggregation Consolidate multiple I/O interfaces and bus logic into a single compact package for space-constrained systems.
Unique Advantages
- Automotive-Qualified Silicon: AEC-Q100 qualification and automotive grade designation reduce validation burden for vehicle-level designs.
- Substantial On-Chip Resources: 33,280 logic elements and approximately 1.84 Mbits of embedded memory enable integrated digital designs without immediate reliance on external memory.
- Compact, Assembly-Friendly Package: The 324-CSPBGA (15×15) surface-mount package supports compact board layouts and standard SMT assembly processes.
- Wide Operating Temperature: −40 °C to 100 °C rating supports deployment across harsh thermal environments.
- Low-Voltage Core Operation: 950 mV to 1.05 V supply range supports lower-power system designs and consistent core operation within the device family.
- Regulatory Compliance: RoHS compliance aligns with modern environmental and manufacturing requirements.
Why Choose XA7A35T-2CSG324I?
The XA7A35T-2CSG324I positions itself as a compact, automotive-qualified FPGA option that balances on-chip logic density, embedded memory, and a wide operating temperature range. It is suited for engineers designing automotive or robust embedded systems that require a qualified, surface-mount FPGA with ample I/O and memory resources.
Choosing this part provides a clear path to integration—minimizing external components while leveraging a qualified device footprint that supports production-level assembly and environmental compliance.
Request a quote or submit an inquiry to receive pricing, availability, and ordering information for XA7A35T-2CSG324I. Our team will respond with details to support your design and procurement needs.

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