XC3142-3PG132C

The XC3142-3PG132C is a Field Programmable Gate Array (FPGA) IC from AMD’s XC3100 family, offered in a 132-BCPGA through-hole package. It delivers a compact, commercial-grade programmable logic solution with moderate logic density, on-chip RAM, and a high I/O count for embedded applications.

With 144 logic elements, approximately 30,784 bits of embedded memory and 96 I/O pins, this device is suited to commercial embedded designs that require a balance of logic resources, memory, and I/O in a 5 V supply environment.

Key Features

• Core Architecture XC3100-series FPGA logic in a programmable silicon device manufactured by AMD, intended for general-purpose programmable logic implementations.
• Logic Resources 144 logic elements (LABs/CLBs) providing approximately 3,000 gates of programmable logic for control, glue logic, and custom finite-state machines.
• On-Chip Memory Approximately 30,784 bits of embedded RAM to support small lookup tables, buffering, and state storage within user logic.
• I/O Capacity 96 general-purpose I/O pins to interface with external peripherals, sensors, and digital buses.
• Power Operates from a 4.75 V to 5.25 V supply range, compatible with legacy 5 V systems.
• Package & Mounting 132-BCPGA / supplier package 132-CPGA (37.08 × 37.08 mm) in a through-hole mounting style for robust board retention and ease of prototyping.
• Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance RoHS compliant for environmental regulatory alignment.

Typical Applications

• Embedded Control — Implement custom control logic, state machines, and glue logic where moderate logic density and on-chip RAM are required.
• Prototyping and Development — Through‑hole BCPGA package and 5 V supply make the device suitable for lab evaluation and iterative hardware development.
• Legacy System Upgrades — Replace or augment existing 5 V programmable logic in commercial systems that need additional I/O and embedded memory.

Unique Advantages

• Balanced Logic and Memory: 144 logic elements combined with ~30,784 bits of RAM provide a useful mix of combinational logic and embedded storage for compact designs.
• High I/O Count: Ninety-six I/Os enable broad interfacing capability to peripherals, buses, and external devices without additional GPIO expanders.
• 5 V System Compatibility: Native 4.75 V to 5.25 V operation supports integration into existing 5 V commercial platforms.
• Robust Mounting for Prototyping: Through-hole 132-BCPGA package simplifies board handling, socketing, and long-term mechanical retention in development environments.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for typical commercial-environment deployments.
• RoHS Compliant: Conforms to RoHS requirements for reduced hazardous substances.

Why Choose XC3142-3PG132C?

The XC3142-3PG132C positions itself as a practical FPGA option for commercial embedded designs that require a moderate number of logic elements, a meaningful on-chip RAM footprint, and a high I/O count in a through-hole BCPGA package. Its 5 V supply range and commercial temperature rating make it well suited for upgrades, prototyping, and legacy 5 V systems.

Engineers and procurement teams seeking a compact, AMD-manufactured FPGA with clear, verifiable specifications for logic, memory, I/O and mounting will find the XC3142-3PG132C straightforward to evaluate and integrate into existing design flows.

Request a quote or submit a pricing request today to check availability and receive lead-time information for the XC3142-3PG132C.