XC3142-3TQ100C

The XC3142-3TQ100C is a field programmable gate array (FPGA) packaged in a 100-pin LQFP/TQFP footprint designed for commercial-grade embedded logic applications. It provides a compact combination of programmable logic, embedded RAM and a substantial I/O count for small to medium-scale digital functions.

With 144 logic elements, about 30.8 kbits of on-chip RAM and 82 user I/O pins, this device is suited for designers needing modest programmable logic capacity in a surface-mount 100-pin package operating from a 4.75 V to 5.25 V supply and a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — 144 logic elements (LEs) providing programmable resources for implementing custom digital functions and control logic.
• Embedded Memory — 30,784 bits of on-chip RAM (approximately 30.8 kbits) for data buffering, state storage and small lookup tables.
• I/O Resources — 82 user I/O pins, enabling broad interfacing to peripherals, sensors and external logic devices.
• Gate Equivalent — Approximately 3,000 gates of logic capacity for glue logic, protocol handling and peripheral control.
• Power Supply — Operates from a 4.75 V to 5.25 V supply, compatible with standard 5 V digital systems.
• Package and Mounting — Available in a 100-pin LQFP package; supplier device package listed as 100-TQFP (14×14). Surface-mount mounting for PCB assembly.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for general-purpose commercial applications.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Glue Logic and System Integration — Implement custom interfacing, signal routing and control logic between discrete components and microcontrollers.
• Peripheral and Sensor Interfacing — Manage multiple I/O lines and small data buffers for sensor aggregation, digital filtering or protocol conversion.
• User Interface Control — Drive and coordinate buttons, LEDs, displays and simple input/output subsystems requiring moderate logic and I/O counts.
• Prototyping and Educational Projects — Suitable for early-stage development and learning where a compact, surface-mount FPGA with modest resources is required.

Unique Advantages

• Compact Programmability: 144 logic elements provide a programmable alternative to fixed-function glue logic, reducing discrete IC count and simplifying board design.
• On-Chip Memory: Approximately 30.8 kbits of embedded RAM enables local buffering and state storage without external memory, lowering BOM and board complexity.
• Generous I/O Count: 82 I/O pins allow flexible interfacing with sensors, peripherals and external buses within a single device.
• Standard 5 V Supply Compatibility: Operates from 4.75 V to 5.25 V for easy integration into existing 5 V digital systems and legacy designs.
• Surface-Mount 100-Pin Package: 100-LQFP / 100-TQFP (14×14) packaging balances pin density and assembly convenience for compact PCB layouts.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for consistent operation in general-purpose commercial environments.

Why Choose XC3142-3TQ100C?

The XC3142-3TQ100C positions itself as a practical, compact FPGA option for designs that require moderate programmable logic, embedded RAM and a substantial I/O complement in a 100-pin surface-mount package. Its 144 logic elements, roughly 30.8 kbits of on-chip RAM and 82 I/O pins deliver the integration needed to replace multiple discrete components and streamline board-level designs.

This device is well suited to engineers developing commercial-grade embedded systems, board-level glue logic, I/O expansion and small-scale prototyping where 5 V supply compatibility, RoHS compliance and a standard temperature range are required. It offers a balance of integration and simplicity for projects targeting reliable, repeatable deployments.

Request a quote or submit an inquiry to receive pricing and availability information for the XC3142-3TQ100C.