XC4062XL-2BG432C

The XC4062XL-2BG432C is a commercial‑grade Field Programmable Gate Array (FPGA) IC from AMD in a 432‑ball Land Grid Array with exposed pad and metal construction. It delivers medium-scale programmable logic capability with a high I/O count and embedded RAM, suitable for commercial electronic designs that require configurable digital logic, flexible interfacing, and on‑chip memory.

Designed for 3.0–3.6 V systems and operation across a 0 °C to 85 °C temperature range, this surface‑mount FPGA combines 5,472 logic elements and approximately 73.7 kbits of on‑chip RAM with 352 I/O pins to support complex glue logic, protocol bridging, and control functions in commercial applications.

Key Features

• FPGA Core Field Programmable Gate Array architecture for user‑defined digital logic and reconfigurable designs.
• Logic Capacity 5,472 logic elements to implement medium‑scale combinational and sequential logic functions.
• Embedded Memory Approximately 73.7 kbits (73,728 bits) of on‑chip RAM for buffering, FIFOs, and small data storage.
• I/O Density 352 available I/O pins to interface with multiple peripherals, buses, and external devices.
• Gate Equivalence Equivalent to 62,000 gates for estimating design complexity and resource planning.
• Power and Supply Operates from 3.0 V to 3.6 V supply rails for compatibility with standard commercial logic levels.
• Package and Mounting 432‑LBGA exposed pad, metal package (supplier package: 432‑MBGA, 40×40) in a surface‑mount form factor for compact board layouts.
• Operating Range Commercial temperature rating: 0 °C to 85 °C for typical commercial environments.
• RoHS Compliant Meets RoHS environmental compliance requirements.

Typical Applications

• Custom Digital Interfaces Use the 352 I/Os and programmable logic to implement protocol translation, bus interfacing, and multi‑device glue logic.
• Control and Sequencing Implement control state machines and timing logic for commercial equipment using the device’s 5,472 logic elements.
• Prototyping and Development Rapidly prototype medium‑scale digital designs and validate system-level behavior with on‑chip RAM and flexible I/O.

Unique Advantages

• High I/O Count: 352 I/O pins enable direct connection to multiple peripherals and parallel interfaces, reducing the need for external multiplexers.
• Balanced Logic and Memory: 5,472 logic elements paired with approximately 73.7 kbits of embedded RAM support a wide range of medium‑complexity designs without external memory.
• Compact Surface‑Mount Package: 432‑LBGA exposed pad metal package allows dense PCB placement and effective thermal conduction for commercial assemblies.
• Standard Voltage Compatibility: 3.0–3.6 V supply range aligns with common commercial logic power rails for simpler power design.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C environments suitable for typical commercial product deployments.
• RoHS Compliance: Environmentally compliant for markets requiring lead‑free components.

Why Choose XC4062XL-2BG432C?

The XC4062XL-2BG432C delivers a practical combination of configurable logic resources, embedded memory, and high I/O capability in a compact 432‑LBGA package. Its specification set—5,472 logic elements, 352 I/Os, and on‑chip RAM—makes it well suited for designers building commercial devices that need medium‑scale programmable logic, interface consolidation, and prototyping flexibility.

With a standard 3.0–3.6 V supply range, commercial temperature rating, and RoHS compliance, this FPGA provides a dependable platform for a broad set of commercial electronic applications where configurable digital logic and dense I/O are required.

Request a quote or submit an inquiry to receive pricing and availability information for the XC4062XL-2BG432C. Our team can assist with lead time and ordering details.