XC4062XL-2HQ240C

The XC4062XL-2HQ240C is a field programmable gate array (FPGA) device in the XC4000E/X family, offered in a 240‑pin BFQFP package with an exposed pad. It provides a mid-range programmable logic resource set with 5,472 logic elements, approximately 72 Kbits of on‑chip RAM, and support for up to 193 I/O pins.

Designed for commercial‑grade applications, this device operates from a 3.0 V to 3.6 V supply and across a 0 °C to 85 °C temperature range, delivering a balance of integration and I/O capacity in a surface‑mount footprint.

Key Features

• Core Logic 5,472 logic elements provide the programmable fabric for implementing custom digital logic and glue functions.
• Embedded Memory Approximately 72 Kbits of total on‑chip RAM to support FIFOs, small buffers and state storage for control logic.
• I/O Capacity Up to 193 general‑purpose I/O pins to interface with multiple peripherals, buses, and external devices.
• Gate Count Equivalent to 62,000 gates, enabling moderate complexity digital designs within a single device.
• Package and Mounting 240‑BFQFP with exposed pad (240‑PQFP, 32×32) in a surface‑mount package for PCB assembly and thermal conduction.
• Power Supply Single‑supply operation from 3.0 V to 3.6 V, suitable for common commercial logic systems.
• Operating Grade Commercial grade device rated for 0 °C to 85 °C ambient operation.
• Regulatory RoHS compliant.

Typical Applications

• Custom digital logic and glue logic — Implement mid‑complexity state machines, protocol converters, and control logic using the device’s 5,472 logic elements and 193 I/Os.
• Interface and bus bridging — Use the high I/O count to connect multiple parallel and serial interfaces or to consolidate discrete glue components.
• Embedded buffering and timing — Leverage the approximately 72 Kbits of on‑chip RAM for small FIFOs, buffering and timing alignment in data paths.

Unique Advantages

• Ample logic density: 5,472 logic elements allow for substantial custom logic integration within a single FPGA package, reducing external component count.
• Significant I/O availability: 193 I/O pins enable broad connectivity for multi‑interface designs or dense peripheral integration.
• On‑chip memory: Approximately 72 Kbits of embedded RAM supports buffering and state retention without external memory.
• Compact surface‑mount package: 240‑BFQFP with exposed pad provides a high‑pin‑count solution in a board‑mountable footprint with improved thermal path.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronic products and systems.
• RoHS compliant: Meets RoHS requirements for lead‑free assembly and environmental compliance.

Why Choose XC4062XL-2HQ240C?

The XC4062XL-2HQ240C offers a well‑rounded combination of logic capacity, embedded memory, and high I/O count for commercial FPGA designs that require moderate complexity and extensive interfacing. Its 240‑pin BFQFP exposed‑pad package provides a practical footprint for surface‑mount assembly while supporting thermal management.

This device is suited to designers seeking to consolidate discrete logic, implement protocol bridges, or add programmable control functions while maintaining standard commercial temperature and voltage requirements. The device’s feature set supports scalable designs where integration and I/O flexibility are priorities.

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