XC4062XL-3BG432C

The XC4062XL-3BG432C is a field programmable gate array (FPGA) IC from AMD’s XC4000E/X family, packaged in a 432-LBGA with exposed pad. It delivers a balanced combination of logic capacity, I/O density and on-chip RAM for commercial embedded and systems applications.

With 5,472 logic elements, 352 I/Os and approximately 0.074 Mbits of embedded memory, this device targets designs that require moderate gate count, substantial parallel I/O and a 3.0–3.6 V supply operating across a commercial temperature range.

Key Features

• Logic Capacity  Approximately 5,472 logic elements providing programmable logic resources for combinatorial and sequential logic implementations.
• On-chip Memory  Approximately 0.074 Mbits (73,728 bits) of embedded RAM to support local buffering, FIFOs and small lookup tables.
• I/O Density  352 user I/O pins to support parallel interfaces, wide buses and multiple peripheral connections.
• Gate Equivalence  62,000 equivalent gates for estimating integration of glue logic, protocol handling and peripheral control functions.
• Power and Supply  Standard 3.0 V to 3.6 V supply range compatible with common commercial logic power rails.
• Package & Mounting  432-LBGA exposed pad, metal package (supplier package: 432-MBGA, 40×40) optimized for surface-mount PCB assembly and thermal conduction through the exposed pad.
• Operating Range  Commercial temperature rating from 0 °C to 85 °C for general-purpose electronic products and development platforms.
• RoHS Compliance  RoHS-compliant manufacturing to meet common lead-free process requirements.

Typical Applications

• Embedded Systems  Implement glue logic, protocol bridges and custom control functions where moderate logic and many I/Os are required.
• Consumer Electronics  Support user-interface control, signal conditioning and peripheral aggregation in consumer devices using a commercial temperature profile.
• Communications Modules  Provide parallel I/O and on-chip RAM for framing, buffering and interface adaptation in communications and networking modules.
• Test and Measurement Equipment  Drive parallel data acquisition channels, implement timing control and preprocess signals with local RAM buffering.

Unique Advantages

• Balanced Logic and I/O Count: 5,472 logic elements paired with 352 I/Os let you integrate control, interfacing and processing without excessive external glue logic.
• Embedded RAM for Local Buffering: Approximately 73,728 bits of on-chip RAM reduce dependence on external memory for small FIFO and buffer needs.
• Packaged for Surface-Mount Assembly: 432-LBGA with exposed pad supports efficient PCB mounting and improved thermal path for compact board layouts.
• Commercial Voltage and Temperature Compatibility: Operates from 3.0 V to 3.6 V and 0 °C to 85 °C, aligning with common commercial designs and supply rails.
• Clear Gate and Resource Metrics: Published counts for gates, logic elements and RAM simplify capacity planning and resource allocation during design.

Why Choose XC4062XL-3BG432C?

The XC4062XL-3BG432C positions itself as a practical FPGA option for commercial designs that need a mid-range mix of logic, I/O and on-chip memory in a compact BGA package. Its combination of 5,472 logic elements, 352 I/Os and a 432-LBGA exposed pad package makes it suitable for engineers implementing protocol interfacing, control logic and data buffering within standard commercial operating conditions.

Designed and manufactured by AMD, the device provides clear, verifiable specifications for capacity, power and thermal considerations, helping teams scale from prototyping to production where these specific resource levels meet project requirements.

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