XC4062XL-3BG432I

The XC4062XL-3BG432I is a Field Programmable Gate Array (FPGA) from the XC4000E/X family offered in a 432-LBGA exposed pad metal package. It provides a programmable logic fabric with 5,472 logic elements, on-chip RAM, and a high I/O count for designs that require configurable digital logic and extensive interfacing.

Targeted at industrial applications, this device supports a wide operating temperature range and a 3.0 V to 3.6 V supply range, enabling deployment in environments that demand robust electrical and thermal performance.

Key Features

• Logic Capacity — 5,472 logic elements providing up to 62,000 equivalent gates for implementing custom digital functions and state machines.
• Embedded Memory — Approximately 0.074 Mbits of on-chip RAM (73,728 bits) for data buffering, FIFOs, and small local storage.
• I/O Density — 352 I/O pins to support extensive parallel interfaces, bus connections, and multiple peripheral attachments.
• Package Options — 432-LBGA exposed pad, metal package (supplier package 432-MBGA, 40×40) for compact, high-density board integration and thermal conduction.
• Power — Operates from a 3.0 V to 3.6 V supply range suitable for common system rails.
• Environmental and Grade — Industrial grade device with RoHS compliance and an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Mounting — Surface mount package designed for PCB assembly in compact designs.

Typical Applications

• Industrial Control — Use in automation and control systems where industrial temperature rating and robust I/O count enable reliable interfacing with sensors, actuators, and fieldbus devices.
• High-Density Digital Logic — Implementation of custom processing pipelines, protocol bridges, and state machines that leverage 5,472 logic elements and approximately 62k gates of logic capacity.
• I/O-Intensive Systems — Suitable for designs requiring many parallel interfaces or multiple peripheral connections, benefiting from 352 available I/O pins.

Unique Advantages

• Substantial Logic Resources: 5,472 logic elements and 62,000 gates allow substantial on-chip implementation of digital functions without immediate external CPLDs or ASICs.
• High I/O Count: 352 I/Os reduce the need for external multiplexing or I/O expanders in complex interface designs.
• Compact, Thermally-Conductive Package: 432-LBGA exposed pad, metal package supports dense PCB layouts while aiding heat dissipation.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in harsher operating conditions typical of industrial environments.
• Standard System Voltage: 3.0 V to 3.6 V supply compatibility simplifies integration with common system power rails.
• RoHS Compliant: Meets RoHS environmental requirements for lead-free assembly processes.

Why Choose XC4062XL-3BG432I?

The XC4062XL-3BG432I balances considerable logic density, abundant I/O, and on-chip memory in a compact 432-LBGA package, making it a practical choice for industrial-grade programmable logic designs. Its operating voltage and temperature specifications allow straightforward integration into systems that require consistent performance across a wide range of conditions.

This device is well suited for engineers developing mid-density digital systems, I/O-heavy interfaces, or industrial control applications where the combination of logic capacity, memory, and package thermal characteristics deliver long-term value through scalable, maintainable hardware designs.

Request a quote or submit an inquiry to receive pricing and availability information for the XC4062XL-3BG432I. Our team can provide lead-time details and help match this FPGA to your design requirements.