XC4062XL-3HQ304C

The XC4062XL-3HQ304C is a commercial-grade Field Programmable Gate Array (FPGA) IC from AMD designed for configurable digital logic in surface-mount packages. It provides a balance of logic density, on-chip memory, and I/O capacity for commercial embedded designs that require custom programmable logic.

With 5,472 logic elements, approximately 73,728 bits of on-chip RAM and 256 user I/O pins, this device supports mid-range programmable designs within a 3.0–3.6 V supply window and a 0 °C to 85 °C operating temperature.

Key Features

• Core Logic 5,472 logic elements providing the configurable resources required for custom digital functions and state machines.
• Embedded Memory Approximately 73,728 bits of on-chip RAM for data buffering, small lookup tables, and register storage.
• I/O and Gate Count 256 user I/O pins and a gate-equivalent count of 62,000 to support parallel interfaces and moderate system integration.
• Power Operates from a 3.0 V to 3.6 V supply, compatible with common commercial logic power domains.
• Package and Mounting 304-BFQFP exposed pad (304-PQFP, 40 × 40) surface-mount package for compact PCB integration and thermal anchoring through the exposed pad.
• Operating Range Commercial temperature range of 0 °C to 85 °C suitable for standard commercial electronics environments.
• Compliance RoHS compliant, meeting common lead-free environmental requirements for commercial assemblies.

Typical Applications

• Custom Digital Logic — Implement application-specific state machines, protocol bridges, and glue logic using the device's logic elements and on-chip RAM.
• I/O-Intensive Interfaces — Leverage 256 I/O pins to interface with multiple peripherals, sensors, or parallel data buses in embedded systems.
• Embedded System Integration — Integrate control and signal-processing tasks within commercial embedded products that operate within the specified voltage and temperature ranges.

Unique Advantages

• Highly Integrated Solution: Combines 5,472 logic elements, on-chip RAM and 62,000 gate-equivalent capacity to reduce external component count and simplify designs.
• Ample I/O Resources: 256 user I/O pins provide flexibility for interfacing multiple peripherals, enabling richer system connectivity on a single device.
• Compact, Surface-Mount Package: 304-pin BFQFP with exposed pad (40 × 40) supports compact PCB layouts and effective thermal management in surface-mount assemblies.
• Commercial Temperature Compatibility: Rated 0 °C to 85 °C to match common commercial product environments and deployment scenarios.
• RoHS Compliant: Meets lead-free requirements for modern commercial production and regulatory compliance.
• Standard Supply Voltage: 3.0–3.6 V operation aligns with widely used commercial logic power rails.

Why Choose XC4062XL-3HQ304C?

The XC4062XL-3HQ304C delivers a balanced combination of logic capacity, embedded memory, and extensive I/O in a 304-pin surface-mount package, making it well suited for commercial embedded designs that require configurable digital logic and moderate on-chip resources. Manufactured by AMD, this FPGA offers a clear specification set for projects that need predictable performance within a 3.0–3.6 V supply and a 0 °C to 85 °C operating range.

Choose this device when your design calls for mid-range programmable logic density, significant I/O pin count, and RoHS-compliant packaging in a compact footprint.

Request a quote or submit an inquiry to obtain pricing and availability for the XC4062XL-3HQ304C for your next design.