XC4062XL-3HQ304I

The XC4062XL-3HQ304I is an AMD XC4000E/X series field programmable gate array (FPGA) supplied in a 304-pin BFQFP package with exposed pad. It combines a multi-thousand–element logic array with on-chip RAM and a high I/O count to support embedded logic implementations in industrial environments.

Designed for applications that require a balance of logic capacity, I/O density, and industrial temperature tolerance, this device provides a configurable hardware building block for custom digital functions and board-level integration.

Key Features

• Core Logic 5,472 logic elements and approximately 62,000 gates for implementing custom combinational and sequential logic.
• Embedded Memory Approximately 0.074 Mbits of on-chip RAM (73,728 bits) for buffering, state storage, and small data structures.
• I/O Capacity 256 I/O pins to support multiple peripherals, external buses, and board-level interfaces.
• Power Operates from a 3 V to 3.6 V supply range to match common system power rails.
• Package & Mounting 304-BFQFP with exposed pad (supplier device package: 304-PQFP, 40 × 40) in a surface-mount form factor for PCB assembly.
• Industrial Temperature Range Rated for operation from –40 °C to 100 °C and supplied as industrial grade.
• Standards Compliance RoHS compliant.

Typical Applications

• Industrial Control Implement custom control logic and multi-signal interfacing that leverages the device’s industrial operating range and 256 I/O pins.
• Embedded System Prototyping Use the FPGA for proof-of-concept hardware designs where 5,472 logic elements and on-chip RAM meet prototyping needs.
• I/O Expansion and Bus Bridging Deploy as a programmable bridge or I/O aggregator to adapt and translate signals between system components.
• Custom Logic Acceleration Offload application-specific hardware functions into the FPGA fabric using the available logic and RAM resources.

Unique Advantages

• Substantial Logic Capacity: 5,472 logic elements and ~62,000 gates enable a wide range of custom logic implementations without external PLDs.
• High I/O Density: 256 I/O pins reduce the need for additional interface components and simplify board-level connectivity.
• On-Chip Memory: Approximately 0.074 Mbits of embedded RAM provides local storage for buffering and state retention within the FPGA.
• Industrial Suitability: Rated from –40 °C to 100 °C and designated industrial grade for deployment in temperature-demanding environments.
• Compact, Surface-Mount Package: 304-pin BFQFP (40 × 40) with exposed pad offers a space-efficient form factor for PCB integration.
• RoHS Compliant: Conforms to RoHS requirements for environmental compliance in assemblies.

Why Choose XC4062XL-3HQ304I?

The XC4062XL-3HQ304I positions itself as an industrial-grade FPGA option that balances logic element count, on-chip RAM, and a high number of I/Os in a compact surface-mount package. Its voltage range and temperature rating make it appropriate for embedded and industrial designs that require configurable digital logic and reliable operation across a wide thermal envelope.

This device is suited for design teams and procurement seeking a field-programmable solution from AMD with clear, verifiable specifications for logic capacity, memory, I/O, package, and environmental ratings—delivering scalability and predictable integration into board-level systems.

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