XC4085XL-1BG560C

The XC4085XL-1BG560C is a field programmable gate array (FPGA) IC from AMD, offered in the XC4000E/X family and supplied in a 560-ball L-BGA package with an exposed metal pad. It provides a commercial-grade, surface-mount FPGA option with a balance of logic density, on-chip memory and extensive I/O for mid-density programmable logic designs.

Designed for commercial applications, the device operates from a 3.0 V to 3.6 V supply and supports an ambient operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Density  7,448 logic elements provide mid-range programmable logic capacity suitable for complex combinational and sequential designs.
• Configurable Logic Blocks (CLBs)  3,136 CLBs available to structure user logic and implement custom state machines and datapaths.
• Embedded Memory  Approximately 0.10 Mbits (100,352 bits) of on-chip RAM for LUTs, FIFOs and small buffers.
• Gate Count  Equivalent to 85,000 gates, offering a practical metric for comparing overall device complexity and integration potential.
• High I/O Count  448 user I/O pins enable dense interfacing with peripherals, buses and external memory.
• Power and Operating Range  Single-supply operation from 3.0 V to 3.6 V simplifies power supply design for 3.3 V systems.
• Package and Mounting  560-ball MBGA package (42.5 × 42.5 mm) with exposed pad and metal finish supports surface-mount assembly and thermal conduction through the package.
• Commercial Grade and Compliance  Rated for 0 °C to 85 °C operating temperature and RoHS compliant for regulatory and manufacturing readiness.

Typical Applications

• Commercial embedded systems  Use the XC4085XL-1BG560C where mid-density programmable logic and extensive I/O are required in commercial-grade products.
• High-density I/O interfaces  Leverage 448 I/Os to implement multi-protocol interfaces, bus bridging and peripheral aggregation.
• Custom logic integration  Deploy the device to consolidate glue logic, state machines and application-specific processing within a single FPGA.

Unique Advantages

• Balanced logic and memory resources: 7,448 logic elements and approximately 0.10 Mbits of embedded RAM enable a mix of complex logic and local buffering in one device.
• Extensive I/O capacity: 448 user I/Os reduce the need for external I/O expanders and simplify board-level routing for multi-interface designs.
• Practical commercial-grade rating: Specified for 0 °C to 85 °C operation, matching typical commercial deployment environments.
• Standard 3.3 V supply compatibility: Operation from 3.0 V to 3.6 V aligns with common 3.3 V system rails, easing power-supply design.
• Surface-mount, exposed-pad package: The 560-LBGA with exposed pad supports robust thermal conduction and compact PCB integration.
• RoHS compliant: Meets RoHS requirements to support compliant manufacturing and assembly processes.

Why Choose XC4085XL-1BG560C?

The XC4085XL-1BG560C positions itself as a mid-density, commercial-grade FPGA that blends significant logic capacity, on-chip memory and a very high I/O count in a compact 560-ball L-BGA package. Its 3.0 V–3.6 V supply range and commercial temperature rating make it suitable for a wide range of non-industrial embedded designs that require consolidated programmable logic and dense external interfacing.

For teams seeking to reduce board-level complexity while retaining flexible, field-programmable functionality, this AMD XC4000E/X family device provides a practical balance of integration, package-level thermal design and compliance for streamlined production.

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