XC4085XL-3BG560C

The XC4085XL-3BG560C is an XC4000E/X Field Programmable Gate Array (FPGA) IC from AMD. It integrates 7,448 logic elements and approximately 85,000 gates with on-chip memory and a high I/O count into a compact 560-LBGA package.

This commercial-grade FPGA supports a 3.0 V to 3.6 V supply and operates across a 0 °C to 85 °C temperature range, offering a balance of programmable logic capacity, embedded memory, and dense I/O for space-constrained board-level designs.

Key Features

• Core Logic  7,448 logic elements and approximately 85,000 gates provide substantial programmable logic capacity for mid-range designs.
• Embedded Memory  Approximately 0.10 Mbits of on-chip RAM (100,352 bits) for buffering, small lookup tables, and local storage.
• I/O Density  448 user I/O pins to support wide parallel buses or multiple interface channels without external expanders.
• Power  Single-supply operation from 3.0 V to 3.6 V to match common commercial electronic platforms.
• Package & Mounting  560-LBGA exposed pad, metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm) designed for surface-mount PCB assembly and thermal coupling via the exposed pad.
• Operating Conditions & Grade  Commercial temperature range of 0 °C to 85 °C and commercial-grade qualification.
• Environmental Compliance  RoHS compliant for lead-free manufacturing and environmental regulatory compatibility.

Typical Applications

• High-density programmable logic  Implement custom digital functions and glue logic using the device's 7,448 logic elements and 85,000 gates.
• I/O-intensive interfaces  Leverage the 448 I/O pins for wide parallel buses, multiple peripheral connections, or mixed-signal interface routing.
• Embedded buffering and LUTs  Use the approximately 0.10 Mbits of on-chip RAM for small data buffers, FIFOs, and lookup tables to reduce external memory needs.
• Compact board-level integration  The 560-LBGA exposed pad package supports dense, surface-mount PCB designs where board space and thermal conduction are considerations.

Unique Advantages

• Integrated logic density: 7,448 logic elements and ~85,000 gates consolidate significant programmable capacity within a single device, reducing component count.
• High I/O count: 448 I/O pins enable complex interfacing without adding external I/O expansion, simplifying system design.
• On-chip RAM: Approximately 0.10 Mbits of embedded memory provides local storage for buffering and LUTs, easing external memory requirements.
• Compact, thermally-aware package: 560-LBGA with exposed pad and a 42.5 × 42.5 mm footprint supports surface-mount assembly and thermal conduction to the PCB.
• Commercial-ready supply and temperature: Operates from 3.0 V to 3.6 V and across 0 °C to 85 °C to match common commercial electronic systems.
• RoHS compliant: Supports lead-free manufacturing processes and environmental compliance requirements.

Why Choose XC4085XL-3BG560C?

The XC4085XL-3BG560C is a commercial-grade FPGA option that combines mid-range programmable logic capacity, embedded memory, and a high I/O count in a space-efficient 560-LBGA package. Its electrical and thermal characteristics make it suitable for board-level designs that require dense logic, substantial I/O, and on-chip RAM without resorting to multiple discrete devices.

As a member of the XC4000E/X Field Programmable Gate Array family from AMD, this device is intended for engineers and procurement teams seeking a balance of integration and practical system-level attributes such as supply compatibility, surface-mount packaging, and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the XC4085XL-3BG560C.