XC4085XLA-08BG432C

The XC4085XLA-08BG432C is a field programmable gate array (FPGA) IC from AMD in the XC4000XLA/XV family. It delivers a moderate logic density with a compact 432‑ball LBGA exposed pad metal package suitable for surface-mount assembly.

Designed for programmable logic and interface consolidation, this commercial‑grade FPGA provides a balance of logic resources, embedded memory, and I/O capacity for embedded system designs and reconfigurable hardware applications.

Key Features

• Core Logic  7,448 logic elements provide the programmable fabric for implementing custom digital logic and finite state machines.
• On‑chip Memory  Approximately 0.10 Mbits (100,352 bits) of embedded RAM for FIFOs, small buffers, and local data storage.
• I/O Capacity  312 user I/O pins enable broad connectivity to peripherals, sensors, and interface devices.
• Logic Gate Equivalent  Approximately 55,000 gates for estimating integration level and partitioning between FPGA and external logic.
• Power  Operates from a 3.0 V to 3.6 V supply range compatible with common 3.3 V system rails.
• Package & Mounting  432‑LBGA exposed pad, metal package (supplier device package: 432‑MBGA, 40×40) in a surface‑mount form factor for compact board layouts and thermal conduction through the exposed pad.
• Operating Range  Commercial temperature rating from 0°C to 85°C for typical commercial environment deployment.
• Environmental Compliance  RoHS compliant for lead‑free manufacturing processes.

Typical Applications

• Embedded Systems  Implement custom control logic, interface glue, and protocol handling using the FPGA’s 7,448 logic elements and extensive I/O.
• Communication Interfaces  Consolidate multiple parallel or serial interfaces and perform protocol bridging with high I/O count and on‑chip memory for buffering.
• Prototyping and Development  Rapidly iterate digital designs and validate custom logic implementations in a compact LBGA package suited for development boards and proof‑of‑concept units.

Unique Advantages

• Balanced Logic Density:  7,448 logic elements and ~55,000 gate equivalence provide sufficient capacity for mid‑range programmable logic tasks without excessive complexity.
• High I/O Count:  312 I/Os simplify system integration by reducing the need for external I/O expanders or glue logic.
• Compact, Thermally Conscious Package:  The 432‑LBGA exposed pad, metal package supports surface‑mount assembly while allowing heat dissipation through the exposed pad for denser board layouts.
• Standard 3.3 V Powering:  Operates on a 3.0 V to 3.6 V supply range, aligning with common system power rails to ease power supply design.
• Commercial Temperature Suitability:  Rated 0°C to 85°C to match typical commercial electronics deployment scenarios.
• Regulatory Readiness:  RoHS compliance supports lead‑free assembly and regulatory requirements in a wide range of markets.

Why Choose XC4085XLA-08BG432C?

The XC4085XLA-08BG432C provides a practical mix of logic resources, embedded memory, and a high I/O count in a compact 432‑LBGA exposed pad package. Its commercial temperature rating and 3.0 V–3.6 V supply range make it suitable for a broad set of programmable logic tasks in embedded and communications projects.

This FPGA is well suited to designers who need moderate logic density and flexible I/O in a surface‑mount form factor, offering a scalable option within the XC4000XLA/XV family for prototyping, integration, and deployment in commercial electronic products.

Request a quote or submit an inquiry to obtain pricing and availability for the XC4085XLA-08BG432C. Our team can provide lead‑time estimates and support your component selection process.