XC4085XLA-09BG432C

The XC4085XLA-09BG432C is a field programmable gate array (FPGA) packaged in a 432-LBGA exposed pad metal package suitable for surface-mount assembly. It provides a balanced combination of logic capacity, I/O density and on-chip RAM for mid-range digital logic integration in commercial-temperature designs.

Designed for applications that require substantial programmable logic and peripheral connectivity, this device supports a 3.0 V to 3.6 V supply range and operates across a commercial temperature window of 0 °C to 85 °C.

Key Features

• Logic Capacity — 7,448 logic elements and approximately 55,000 gates enable medium-scale custom logic implementation and state-machine designs.
• Embedded Memory — Approximately 0.10 Mbits of on-chip RAM (100,352 bits) for buffering, small data storage and register-file implementations.
• I/O Density — 312 user I/O pins to support extensive peripheral interfacing and multi-channel connectivity.
• Package and Mounting — 432-LBGA exposed pad metal package (supplier package: 432-MBGA, 40×40) optimized for surface-mount PCB assembly and thermal conduction through the exposed pad.
• Power — Operates from a 3.0 V to 3.6 V supply range to match typical commercial logic rails.
• Operating Range — Commercial grade operation from 0 °C to 85 °C, suitable for a wide range of non-industrial applications.
• Compliance — RoHS compliant.

Typical Applications

• Peripheral and Interface Control — Use the 312 I/O pins to implement custom interfacing, protocol bridging and multi-peripheral control logic.
• Embedded Logic and Glue Logic — 7,448 logic elements and ~55,000 gates make the device suitable for consolidating discrete logic and implementing complex control state machines.
• On-chip Buffering and Small Data Stores — Approximately 0.10 Mbits of embedded memory supports data buffering, FIFO implementations and small lookup tables.

Unique Advantages

• High Logic and Gate Count: 7,448 logic elements and ~55,000 gates provide substantial programmable resources for mid-scale designs without external logic expansion.
• Generous I/O: 312 I/O pins enable broad connectivity to sensors, peripherals and external memories, reducing the need for external multiplexing or I/O expanders.
• Compact, Thermally Aware Package: 432-LBGA with an exposed pad (432-MBGA, 40×40) supports surface-mount assembly and improved thermal transfer for sustained operation at commercial temperatures.
• Standard Supply Range: 3.0 V to 3.6 V operation aligns with common commercial supply rails for straightforward power system integration.
• Regulatory Compliance: RoHS compliance simplifies material compliance considerations for commercial product development.

Why Choose XC4085XLA-09BG432C?

The XC4085XLA-09BG432C positions itself as a practical mid-range FPGA solution that balances programmable logic density, I/O count and on-chip memory for commercial-temperature applications. Its 432-LBGA exposed pad package supports surface-mount manufacturing while providing a path for thermal management in board-level designs.

This device is well suited for design teams delivering embedded control, interface consolidation or prototype-to-product bridging where a reliable, RoHS-compliant FPGA with substantial I/O and logic resources is required. The combination of logic elements, gates, embedded RAM and pin count delivers scalable capability for a range of non-industrial commercial applications.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC4085XLA-09BG432C. Our team can provide part availability and support documentation to assist with your design and sourcing process.