XC4085XLA-09HQ208C

The XC4085XLA-09HQ208C is a Field Programmable Gate Array (FPGA) IC from AMD, part of the XC4000XLA/XV family. It provides on-chip programmable logic and memory resources suitable for custom digital designs in commercial applications.

Key device attributes include 7,448 logic elements, approximately 0.10 Mbits (100,352 bits) of embedded RAM, 168 I/O pins, and roughly 55,000 gates of logic capacity. The device is supplied for surface-mount assembly in a 208-pin BFQFP exposed-pad package and operates from 3 V to 3.6 V over a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Capacity — 7,448 logic elements provide substantial programmable logic for implementing custom state machines, finite logic, and combinational/sequential circuits.
• Embedded Memory — Approximately 0.10 Mbits (100,352 bits) of on-chip RAM for buffering, lookup tables, and small data storage without external memory.
• I/O Resources — 168 user I/O pins support extensive peripheral and bus interfacing directly from the FPGA fabric.
• Logic Scale — Approximately 55,000 gates of logic capacity for mid-range integration of digital functions.
• Power — Operates from 3 V to 3.6 V, enabling compatibility with common commercial supply rails.
• Package & Mounting — Supplied in a 208-BFQFP exposed-pad package (supplier device package listed as 208-PQFP, 28×28) designed for surface-mount PCB assembly.
• Operating Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• RoHS Compliance — Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Custom digital logic and control — Use the device’s 7,448 logic elements and ~55,000 gates to implement protocol handlers, control logic, and custom finite-state machines in commercial systems.
• I/O-intensive interfacing — The 168 I/O pins enable direct interfacing to multiple peripherals, sensors, and parallel/serial buses without extensive external glue logic.
• Board-level integration and prototyping — The 208-pin BFQFP exposed-pad surface-mount package supports compact board layouts and prototyping of custom FPGA-based subsystems for commercial products.

Unique Advantages

• Substantial programmable logic density: 7,448 logic elements and ~55,000 gates allow consolidation of multiple discrete functions into a single FPGA, reducing BOM complexity.
• On-chip memory reduces external part count: Approximately 0.10 Mbits of embedded RAM provides local storage for buffering and lookup tables, lowering reliance on external memory devices.
• High I/O count for flexible interfacing: 168 I/O pins accommodate a wide range of peripherals and system buses, simplifying signal routing and board-level integration.
• Commercial-ready operating range: Rated for 0 °C to 85 °C, matching typical commercial application requirements.
• Surface-mount, exposed-pad package: The 208-BFQFP exposed-pad (208-PQFP, 28×28) form factor supports efficient thermal performance and compact PCB designs.
• RoHS compliant: Conforms to RoHS environmental requirements for many commercial product supply chains.

Why Choose XC4085XLA-09HQ208C?

The XC4085XLA-09HQ208C combines a significant logic element count, on-chip RAM, and a high I/O complement in a compact surface-mount package, making it well suited for commercial designs that require mid-range programmable logic and flexible interfacing. Its defined voltage range and commercial temperature rating provide predictable integration for standard electronic products.

This device is appropriate for teams and projects that need to consolidate digital functions, reduce external component count, and implement custom logic in a single FPGA footprint while maintaining RoHS compliance and common commercial operating parameters.

Request a quote or submit an inquiry to obtain pricing and availability for the XC4085XLA-09HQ208C for your design and procurement planning.