XC4VFX100-10FFG1152C

The XC4VFX100-10FFG1152C is a Virtex®-4 FX Field Programmable Gate Array (FPGA) from AMD, supplied in a 1152-FCBGA package. It delivers a high logic count and substantial on-chip memory with a large I/O complement, making it suitable for complex board-level digital designs that require dense logic, embedded memory, and broad interfacing capability.

Key electrical and environmental parameters include a core supply range of 1.14 V to 1.26 V, commercial operating temperature from 0°C to 85°C, and RoHS compliance.

Key Features

• Logic Capacity  Provides 94,896 logic elements for implementing large FPGA designs and complex algorithms.
• Embedded Memory  Approximately 6.93 Mbits of on-chip RAM for buffering, data storage, and state retention within the FPGA fabric.
• I/O Density  576 general-purpose I/O pins to support extensive board-level connectivity and parallel interfaces.
• Package and Mounting  Delivered in a 1152-BBGA FCBGA package (supplier device package: 1152-FCBGA, 35 × 35) with surface-mount mounting.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match target power-rail designs.
• Operating Range  Commercial grade operation with an operating temperature range of 0°C to 85°C.
• Compliance  RoHS compliant for environmental regulatory alignment.

Typical Applications

• High-density digital systems  Implement large-scale digital logic and custom accelerators using the device's nearly 95k logic elements and sizable embedded memory.
• High-I/O interface designs  Support complex multi‑lane or parallel interfaces with 576 available I/O pins for system interconnects and board-level routing.
• Memory-intensive functions  Use the approximately 6.93 Mbits of on-chip RAM for buffering, packet storage, and intermediate data processing within the FPGA.

Unique Advantages

• High logic and memory integration:  Combines 94,896 logic elements with around 6.93 Mbits of embedded RAM to reduce external memory and discrete logic requirements.
• Extensive I/O capability:  576 I/O pins enable flexible connectivity and simplify integration with multiple peripherals or high-pin-count interfaces.
• Compact FCBGA package:  1152-FCBGA packaging supports high-density PCB layouts while providing surface-mount compatibility for modern assembly flows.
• Predictable power envelope:  Defined core voltage range (1.14 V to 1.26 V) aids in power-rail planning and system power budgeting.
• Commercial temperature rating:  Rated for 0°C to 85°C operation for standard commercial deployments.

Why Choose XC4VFX100-10FFG1152C?

The XC4VFX100-10FFG1152C is positioned for designs that demand substantial logic resources, significant on-chip memory, and a large number of I/O signals in a single FPGA package. Its combination of nearly 95k logic elements, approximately 6.93 Mbits of embedded RAM, and 576 I/O pins makes it well suited to consolidate functions that would otherwise require multiple devices.

For engineering teams focusing on commercial-grade products, this Virtex‑4 FX device offers a balance of capacity, package density, and defined power and temperature parameters to support scalable digital designs and integration-driven BOM reductions.

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