XC4VFX100-10FFG1517I

The XC4VFX100-10FFG1517I is a Virtex®-4 FX field programmable gate array (FPGA) manufactured by AMD, supplied in a 1517-FCBGA (40×40) package for surface-mount assembly. With a high logic capacity, large on-chip RAM and a broad I/O count, this device is designed for industrial-grade systems that require dense programmable logic and substantial embedded memory in a compact package.

Key Features

• Logic Capacity — 94,896 logic elements to implement complex digital designs and custom processing functions.
• Embedded Memory — Approximately 6.93 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
• I/O Density — 768 user I/O pins to support high-channel-count interfaces and dense connectivity requirements.
• Power — Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Package & Mounting — 1517-FCBGA (40×40) package supplied for surface-mount mounting on compact PCBs.
• Operating Range — Industrial-grade operating temperature range from −40 °C to 100 °C, suitable for harsh environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement custom logic for motor control, PLC extension, or real-time I/O aggregation using the device’s high I/O count and industrial temperature rating.
• Communications Hardware — Build protocol bridging, packet processing, or custom interface logic leveraging abundant logic elements and embedded RAM.
• Embedded Processing — Offload deterministic tasks and custom accelerators to the FPGA fabric where on-chip memory and logic density are required.

Unique Advantages

• High Logic Density: 94,896 logic elements enable implementation of sophisticated logic functions and parallel processing architectures.
• Substantial Embedded Memory: Approximately 6.93 Mbits of on-chip RAM reduces external memory dependence for many buffering and lookup needs.
• Extensive I/O: 768 I/O pins provide flexibility for multi-channel sensor interfaces, high-speed buses, or dense peripheral connectivity.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in demanding environments.
• Compact, High-Density Package: 1517-FCBGA (40×40) package supports high integration on space-constrained PCBs while enabling surface-mount assembly.
• Low-Voltage Core: 1.14 V to 1.26 V core supply aligns with modern board power architectures.

Why Choose XC4VFX100-10FFG1517I?

The XC4VFX100-10FFG1517I delivers a combination of high logic capacity, significant embedded memory and a large number of I/O in an industrial-grade FPGA package. It is well suited for engineers designing robust, space-efficient systems that require on-chip resources to implement custom logic, buffering, and dense interfacing.

Manufactured by AMD and provided in a 1517-FCBGA surface-mount package, this device offers a reliable platform for long-term deployments where temperature tolerance, integration density, and on-chip resources are key selection criteria.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the XC4VFX100-10FFG1517I.