XC4VFX100-11FF1152C
| Part Description |
Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 576 6930432 94896 1152-BBGA, FCBGA |
|---|---|
| Quantity | 20 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 576 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 10544 | Number of Logic Elements/Cells | 94896 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6930432 |
Overview of XC4VFX100-11FF1152C – Virtex®-4 FX Field Programmable Gate Array (FPGA), 1152-FCBGA
The XC4VFX100-11FF1152C is a Virtex®-4 FX field programmable gate array (FPGA) IC from AMD designed for commercial embedded logic applications. It combines a large logic fabric with on-chip memory and a high I/O count in a 1152-ball FCBGA package to address complex interfacing and custom logic requirements.
With 94,896 logic elements, approximately 6.93 Mbits of embedded memory and 576 user I/Os, this device is intended for designs that require significant programmable resources and dense I/O connectivity within a surface-mount 35×35 mm package.
Key Features
- Core Logic 94,896 logic elements provide extensive programmable logic capacity for large combinational and sequential designs.
- Embedded Memory Approximately 6.93 Mbits of on-chip RAM to support buffering, data storage and user-defined memory structures.
- I/O Density 576 user I/Os for wide parallel interfaces and multiple high-pin-count connections in a single device.
- Package & Mounting 1152-ball FCBGA (35×35 mm) package, surface-mount mounting for compact, board-level integration.
- Power Supply Supported core voltage range from 1.14 V to 1.26 V to match system power rails and core domain requirements.
- Operating Range & Grade Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Compliance RoHS compliant.
Typical Applications
- Communications Equipment Use the high logic count and abundant I/O to implement protocol processing, interface bridging and packet buffering.
- Signal Processing Leverage embedded memory and large logic capacity for data buffering and custom processing pipelines.
- Prototyping and Development Suitable for hardware validation and system prototyping where a dense programmable fabric and many I/Os are required.
- Industrial Control Implement complex control logic and multiple I/O interfaces within a single commercial-grade FPGA package.
Unique Advantages
- Large Programmable Fabric: 94,896 logic elements provide significant room for complex logic integration and custom architectures.
- Substantial On-Chip Memory: Approximately 6.93 Mbits of embedded RAM reduce dependence on external memory for many buffering and storage needs.
- High I/O Count: 576 user I/Os simplify board-level design by enabling numerous parallel interfaces without additional components.
- Compact Ball-Grid Package: 1152-FCBGA (35×35 mm) consolidates high capacity and I/O into a surface-mount form factor for space-constrained PCBs.
- Commercial Temperature Rating: Specified 0 °C to 85 °C operating range aligns with standard commercial deployments.
- Regulatory Compliance: RoHS compliant for environmentally conscious designs and global supply chain requirements.
Why Choose XC4VFX100-11FF1152C?
The XC4VFX100-11FF1152C positions itself as a high-capacity, commercially rated FPGA for designs that require extensive programmable logic, significant on-chip memory, and dense I/O in a single surface-mount package. Its combination of nearly 95k logic elements, approximately 6.93 Mbits of embedded RAM and 576 I/Os makes it well suited to system-level integration where consolidation of functions and interface density are priorities.
Designed by AMD and offered in a 1152-ball FCBGA package with a defined operating voltage and temperature range, this device provides a practical platform for engineers developing communication, signal processing, prototyping, and industrial control applications that demand a robust, programmable solution.
Request a quote or submit an inquiry to receive pricing and availability for the XC4VFX100-11FF1152C and to discuss how it can fit your design requirements.

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