XC4VFX100-11FF1517C

IC FPGA 768 I/O 1517FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 768 6930432 94896 1517-BBGA, FCBGA

Quantity 85 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O768Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs10544Number of Logic Elements/Cells94896
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6930432

Overview of XC4VFX100-11FF1517C – Virtex®-4 FX FPGA, 1517-FCBGA (40×40)

The XC4VFX100-11FF1517C is a Virtex®-4 FX field programmable gate array (FPGA) IC tailored for commercial designs. It combines a large logic fabric, substantial on-chip memory, and a high I/O count in a 1517-FCBGA (40×40) surface-mount package.

Designed for applications that require significant programmable logic and dense connectivity, this device delivers configurable integration while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C commercial temperature grade.

Key Features

  • Logic Capacity — 94,896 logic elements providing extensive programmable logic resources for complex designs.
  • Embedded Memory — Approximately 6.93 Mbits of embedded memory for data buffering, FIFOs, and on-chip storage.
  • I/O Count — 768 user I/O pins to support dense external interfacing and parallel connectivity.
  • Package & Mounting — 1517-BBGA / 1517-FCBGA (40×40) package in a surface-mount form factor for compact board integration.
  • Power Supply — Operates from a core voltage supply range of 1.14 V to 1.26 V to match precise power requirements.
  • Commercial Grade & Temperature — Rated for commercial use with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS-compliant construction for regulatory and manufacturing consistency.

Unique Advantages

  • Large on-chip logic density: 94,896 logic elements reduce the need for external glue logic and simplify complex digital implementations.
  • Substantial embedded memory: Approximately 6.93 Mbits of on-chip RAM enable local buffering and state storage without immediate dependence on external memory.
  • High I/O availability: 768 I/O pins provide flexibility for parallel interfaces, multi-lane connections, and dense peripheral integration.
  • Compact, high-density packaging: The 1517-FCBGA (40×40) package supports surface-mount assembly while accommodating the device’s I/O and thermal requirements.
  • Predictable power envelope: A defined core voltage range (1.14 V to 1.26 V) aids power-supply design and system-level planning.
  • Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS-compliant, facilitating deployment in standard commercial products and environments.

Why Choose XC4VFX100-11FF1517C?

The XC4VFX100-11FF1517C positions itself as a high-capacity, commercially graded Virtex®-4 FX FPGA that balances extensive logic resources, embedded memory, and a large I/O complement in a compact 1517-FCBGA package. Its clear electrical and thermal ratings simplify integration into commercial designs that demand programmable logic density and on-chip storage.

This device is well suited for design teams and procurement focused on scalable FPGA-based implementations requiring substantial on-chip resources, predictable power requirements, and standard-temperature commercial operation backed by RoHS compliance.

Request a quote or submit a pricing inquiry to receive availability and purchasing information for the XC4VFX100-11FF1517C.

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