XC4VFX100-11FFG1517C
| Part Description |
Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 768 6930432 94896 1517-BBGA, FCBGA |
|---|---|
| Quantity | 104 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 768 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 10544 | Number of Logic Elements/Cells | 94896 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6930432 |
Overview of XC4VFX100-11FFG1517C – Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 1517-FCBGA (40×40)
The XC4VFX100-11FFG1517C is a Virtex®-4 FX field programmable gate array offered in a 1517-ball FCBGA package. It integrates a large logic fabric and sizable on-chip memory with a high count of I/O pins, making it suitable for designs that require dense programmable logic and extensive interface connectivity.
Key device parameters include 94,896 logic elements, approximately 6.93 Mbits of embedded memory, and 768 general-purpose I/Os. The device is surface-mountable, operates from a 1.14 V to 1.26 V supply range, and is rated for commercial temperature operation (0 °C to 85 °C).
Key Features
- Core Logic Contains 94,896 logic elements to support complex digital designs and high-density logic implementation.
- Embedded Memory Approximately 6.93 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
- I/O Capacity 768 I/O pins provide extensive external connectivity for peripherals, interfaces, and parallel data paths.
- Package and Mounting 1517-BBGA, FCBGA package in a 1517-FCBGA (40×40) footprint; designed for surface-mount assembly.
- Power Supply Operates from a core voltage supply range of 1.14 V to 1.26 V.
- Operating Temperature Commercial-grade rating with an operating range of 0 °C to 85 °C.
- Environmental Compliance RoHS-compliant construction for compliance with common environmental requirements.
Typical Applications
- High-density digital processing Use where large programmable logic resources and embedded memory are required for custom datapaths and signal processing.
- Interface aggregation and bridging Leverages 768 I/Os to implement multi-protocol interface logic and bridge functions between subsystems.
- Prototyping and system integration Provides a high-resource platform for validating complex digital architectures and integrating multiple functions into a single device.
Unique Advantages
- High logic capacity: 94,896 logic elements enable complex logic architectures without immediate need for additional devices.
- Substantial on-chip memory: Approximately 6.93 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
- Extensive I/O availability: 768 I/Os simplify connection to numerous peripherals and parallel interfaces, reducing board-level multiplexing complexity.
- Compact FCBGA package: 1517-FCBGA (40×40) delivers high pin count in a package suitable for surface-mount assembly and dense PCB layouts.
- Commercial operating range: Rated 0 °C to 85 °C to match typical commercial system requirements.
- RoHS compliant: Meets common environmental regulations for lead-free assemblies.
Why Choose XC4VFX100-11FFG1517C?
The XC4VFX100-11FFG1517C positions itself as a high-density programmable solution that combines a large logic element count, considerable embedded memory, and a very high I/O count in a 1517-FCBGA package. These characteristics make it well suited for engineers developing systems that require substantial on-chip resources and broad external connectivity within commercial temperature limits.
Selecting this device supports consolidation of complex digital functions into a single FPGA footprint while adhering to common surface-mount assembly and environmental guidelines. Its specified supply and thermal ranges provide clear design constraints for integrating the device into commercial electronic systems.
Request a quote or submit a procurement inquiry for the XC4VFX100-11FFG1517C to check availability and pricing for your next design.

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