XC4VFX100-11FFG1152I

The XC4VFX100-11FFG1152I is a Virtex®-4 FX field programmable gate array (FPGA) from AMD, provided in a 1152-ball FCBGA surface-mount package. It delivers a high count of programmable logic and on-chip RAM together with a large number of I/O pins, targeting designs that require substantial logic capacity and dense I/O integration.

Specified for industrial operation and RoHS compliant, this device supports designs that need a combination of high logic element count, approximately 6.93 Mbits of embedded memory, and wide operating temperature range for reliable deployment in challenging environments.

Key Features

• Logic Capacity — Approximately 94,896 logic elements providing substantial programmable fabric for complex digital designs.
• Embedded Memory — Approximately 6.93 Mbits of on-chip RAM to support data buffering, state storage, and embedded processing.
• I/O Density — 576 user I/O pins to accommodate high-pin-count interfaces and multiple parallel connections.
• Package and Mounting — 1152-FCBGA (35×35) package in a 1152-BBGA footprint designed for surface-mount assembly.
• Power — Core supply voltage range from 1.14 V to 1.26 V for the device core.
• Operating Temperature — Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in demanding environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — High logic capacity and industrial temperature rating support custom control logic and real-time processing in automated systems.
• Embedded Processing and Acceleration — Embedded RAM and extensive programmable fabric enable on-device data handling and hardware acceleration for compute-intensive tasks.
• High-Density I/O Systems — 576 I/O pins accommodate multi-channel sensor interfaces, parallel data streams, and complex board-level connectivity.

Unique Advantages

• High Logic Capacity: Nearly 95k logic elements allow implementation of sizable custom logic, state machines, and data-paths without external ASICs.
• Significant On-Chip Memory: Approximately 6.93 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
• Extensive I/O: 576 I/O pins enable broad connectivity for multi-channel and multi-protocol systems.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Space-Efficient Package: 1152-ball FCBGA (35×35) delivers high integration in a surface-mount form factor suitable for compact assemblies.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing.

Why Choose XC4VFX100-11FFG1152I?

The XC4VFX100-11FFG1152I positions itself as a high-capacity Virtex®-4 FX FPGA that combines extensive programmable logic, substantial embedded memory, and a large I/O count in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for designers seeking robust, high-density programmable solutions for challenging environments.

This device is well suited for teams building complex control, processing, or I/O-intensive systems that require scalable logic resources and on-chip RAM, delivered in a surface-mount FCBGA package with a defined core voltage range for system power planning.

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