XC4VFX12-10FFG668C

The XC4VFX12-10FFG668C is a Virtex-4 FX field programmable gate array from AMD designed for commercial embedded applications that require programmable logic, significant I/O capacity, and on-chip memory. It combines a high-density logic fabric with embedded RAM and a large I/O complement in a 668-ball FCBGA package for board-level integration.

With 12,312 logic elements, 663,552 bits of on-chip RAM, and 320 I/O, this device is suited to designs that need flexible logic implementation, memory-backed functions, and dense external interfacing while operating at commercial temperature ranges.

Key Features

• Core Architecture  Virtex-4 FX field programmable gate array fabric from AMD, providing a programmable logic platform for custom digital designs.
• Logic Capacity  12,312 logic elements for implementing combinational and sequential logic functions and moderate complexity designs.
• Embedded Memory  663,552 bits of on-chip RAM (approximately 0.664 Mbits) to support buffering, FIFOs, or memory-backed logic without external memory for certain functions.
• I/O  320 general-purpose I/O pins to support parallel interfaces, multiple peripherals, and high-density connectivity on a single device.
• Power  Core supply range from 1.14 V to 1.26 V to match system power-rail requirements and ensure proper core operation.
• Package & Mounting  668-ball FCBGA (27 × 27) package in a 668-BBGA/FCBGA case, intended for surface-mount PCB assembly.
• Operating Range & Compliance  Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant for environmental compliance.

Typical Applications

• Commercial Embedded Systems  Implement custom logic, protocol handling, or control functions in board-level products that operate within commercial temperature ranges.
• High-Density I/O Interfaces  Use the 320 I/O pins to aggregate multiple peripheral lines, parallel interfaces, or to implement complex I/O routing and glue logic.
• Memory-Backed Logic Functions  Leverage approximately 0.664 Mbits of embedded RAM for buffering, small FIFOs, or temporary data storage within logic paths.
• Surface-Mount Board Integration  The 668-FCBGA package supports compact PCB layouts where high pin density and surface-mount assembly are required.

Unique Advantages

• High logic density:  12,312 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing external glue logic.
• On-chip memory:  Approximately 0.664 Mbits of embedded RAM enables internal buffering and memory-backed algorithms without immediate reliance on external memory components.
• Large I/O complement:  320 I/O pins simplify system-level connectivity and help minimize the need for additional interface chips.
• Compact board-level package:  The 668-FCBGA (27 × 27) surface-mount package delivers high pin count in a compact footprint for dense PCB designs.
• Commercial-grade compliance:  Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial product requirements.
• Well-defined power envelope:  A core supply range of 1.14 V to 1.26 V aids in stable power-system design and integration.

Why Choose XC4VFX12-10FFG668C?

The XC4VFX12-10FFG668C positions itself as a versatile commercial-grade FPGA for embedded applications that require a balance of logic capacity, embedded RAM, and extensive I/O in a compact surface-mount package. Its combination of 12,312 logic elements, approximately 0.664 Mbits of on-chip memory, and 320 I/O makes it appropriate for board-level designs where integration and I/O density matter.

Choose this Virtex-4 FX device when your design needs programmable logic with internal memory and substantial external connectivity while operating within commercial temperature limits. The 668-FCBGA package and defined core voltage range simplify system integration and power planning for production deployments.

Request a quote or submit an inquiry for XC4VFX12-10FFG668C to check availability and receive pricing and lead-time information tailored to your procurement needs.