XC4VFX12-10FFG668I
| Part Description |
Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 320 663552 12312 668-BBGA, FCBGA |
|---|---|
| Quantity | 355 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 25 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 668-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 668-BBGA, FCBGA | Number of I/O | 320 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 1368 | Number of Logic Elements/Cells | 12312 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 663552 |
Overview of XC4VFX12-10FFG668I – Virtex®-4 FX Field Programmable Gate Array (FPGA) IC
The XC4VFX12-10FFG668I is a Virtex®-4 FX family field programmable gate array provided by AMD. It integrates 1,368 CLBs and 12,312 logic elements with on-chip RAM and a high I/O count to support configurable digital designs.
Targeted for industrial applications, the device combines moderate logic density, embedded memory, and a wide operating temperature range to support programmable system-level functions with a compact 668-ball FCBGA package.
Key Features
- Core Logic
1,368 CLBs delivering 12,312 logic elements for implementing custom logic, state machines, and glue logic. - Embedded Memory
Approximately 0.664 Mbits of on-chip RAM (663,552 total RAM bits) for data buffering, FIFOs, and small on-chip storage. - I/O
320 user I/O pins to support a range of parallel and multiplexed interfaces. - Power / Voltage
Core supply range specified at 1.14 V to 1.26 V to match system power-rail requirements. - Package & Mounting
668-ball FCBGA (27 × 27) package, surface-mount mounting for compact board-level integration. - Temperature & Grade
Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in harsh environments. - Compliance
RoHS compliant to support environmentally conscious designs and supply-chain requirements.
Unique Advantages
- Balanced logic and memory capacity: 12,312 logic elements paired with approximately 0.664 Mbits of embedded RAM enable moderately complex logic functions with local data storage.
- High I/O count: 320 I/O pins provide flexibility for interfacing multiple peripherals, sensors, or parallel busses without external I/O expanders.
- Industrial temperature rating: Rated from −40 °C to 100 °C to support installations that require extended temperature resilience.
- Compact BGA footprint: 668-FCBGA (27×27) package allows dense board-level integration while keeping a high pin count.
- Defined core voltage range: Narrow core supply specification (1.14 V–1.26 V) simplifies power supply planning and consistency across installations.
- RoHS compliant: Meets lead-free and hazardous-substance requirements for modern manufacturing and regulatory alignment.
Why Choose XC4VFX12-10FFG668I?
The XC4VFX12-10FFG668I provides a practical combination of CLB-based logic capacity, embedded RAM, and a large I/O complement in an industrial-grade Virtex®-4 FX FPGA package. Its defined voltage range, robust operating temperature window, and compact 668-FCBGA footprint make it suitable for system designs that require configurable logic and reliable operation in challenging environments.
Designed for engineers and procurement teams seeking a programmable logic device with moderate logic density and flexible I/O, this AMD Virtex®-4 FX device offers a clear specification set for integration, scaling, and long-term deployment.
Request a quote or submit an inquiry to receive pricing and availability information for XC4VFX12-10FFG668I.

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