XC4VFX12-10FFG668I

IC FPGA 320 I/O 668FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 320 663552 12312 668-BBGA, FCBGA

Quantity 355 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time25 Weeks
Datasheet

Specifications & Environmental

Device Package668-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case668-BBGA, FCBGANumber of I/O320Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1368Number of Logic Elements/Cells12312
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits663552

Overview of XC4VFX12-10FFG668I – Virtex®-4 FX Field Programmable Gate Array (FPGA) IC

The XC4VFX12-10FFG668I is a Virtex®-4 FX family field programmable gate array provided by AMD. It integrates 1,368 CLBs and 12,312 logic elements with on-chip RAM and a high I/O count to support configurable digital designs.

Targeted for industrial applications, the device combines moderate logic density, embedded memory, and a wide operating temperature range to support programmable system-level functions with a compact 668-ball FCBGA package.

Key Features

  • Core Logic 
    1,368 CLBs delivering 12,312 logic elements for implementing custom logic, state machines, and glue logic.
  • Embedded Memory 
    Approximately 0.664 Mbits of on-chip RAM (663,552 total RAM bits) for data buffering, FIFOs, and small on-chip storage.
  • I/O 
    320 user I/O pins to support a range of parallel and multiplexed interfaces.
  • Power / Voltage 
    Core supply range specified at 1.14 V to 1.26 V to match system power-rail requirements.
  • Package & Mounting 
    668-ball FCBGA (27 × 27) package, surface-mount mounting for compact board-level integration.
  • Temperature & Grade 
    Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in harsh environments.
  • Compliance 
    RoHS compliant to support environmentally conscious designs and supply-chain requirements.

Unique Advantages

  • Balanced logic and memory capacity: 12,312 logic elements paired with approximately 0.664 Mbits of embedded RAM enable moderately complex logic functions with local data storage.
  • High I/O count: 320 I/O pins provide flexibility for interfacing multiple peripherals, sensors, or parallel busses without external I/O expanders.
  • Industrial temperature rating: Rated from −40 °C to 100 °C to support installations that require extended temperature resilience.
  • Compact BGA footprint: 668-FCBGA (27×27) package allows dense board-level integration while keeping a high pin count.
  • Defined core voltage range: Narrow core supply specification (1.14 V–1.26 V) simplifies power supply planning and consistency across installations.
  • RoHS compliant: Meets lead-free and hazardous-substance requirements for modern manufacturing and regulatory alignment.

Why Choose XC4VFX12-10FFG668I?

The XC4VFX12-10FFG668I provides a practical combination of CLB-based logic capacity, embedded RAM, and a large I/O complement in an industrial-grade Virtex®-4 FX FPGA package. Its defined voltage range, robust operating temperature window, and compact 668-FCBGA footprint make it suitable for system designs that require configurable logic and reliable operation in challenging environments.

Designed for engineers and procurement teams seeking a programmable logic device with moderate logic density and flexible I/O, this AMD Virtex®-4 FX device offers a clear specification set for integration, scaling, and long-term deployment.

Request a quote or submit an inquiry to receive pricing and availability information for XC4VFX12-10FFG668I.

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