XC4VFX12-10SFG363I

The XC4VFX12-10SFG363I is a Virtex®-4 FX Field Programmable Gate Array from AMD designed for industrial-grade applications. It provides 12,312 logic elements, approximately 0.66 Mbits of embedded memory, and 240 user I/O in a 363-FBGA (17×17) package.

Specified for operation from -40 °C to 100 °C with a supply range of 1.14 V to 1.26 V, this surface-mount FPGA is RoHS-compliant and intended for designs that require moderate logic capacity, on-chip RAM, and a robust industrial temperature range.

Key Features

• Core Capacity — 12,312 logic elements to implement custom digital logic and control functions.
• Embedded Memory — Approximately 0.66 Mbits of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O — 240 user-accessible I/O pins to support parallel interfaces, control signals, and peripheral connections.
• Power — Specified operating supply range of 1.14 V to 1.26 V to match system power constraints.
• Package and Mounting — 363-FBGA (17×17) FCBGA package, surface-mount for compact board-level integration.
• Industrial Temperature Grade — Rated for -40 °C to 100 °C operation for use in temperature-challenging environments.
• Environmental Compliance — RoHS-compliant for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control Systems — Leverage the industrial temperature rating and 240 I/O for sensor interfacing, discrete I/O, and control logic in harsh environments.
• Custom Digital Logic and Prototyping — Use the 12,312 logic elements and embedded RAM for implementing state machines, protocol bridges, and custom accelerators during development and low- to mid-volume production.
• I/O-Intensive Interfaces — 240 I/O pins enable aggregation of parallel buses, control signals, or multiple peripheral connections in embedded designs.

Unique Advantages

• Balanced Logic and Memory: A combination of 12,312 logic elements and approximately 0.66 Mbits of embedded RAM supports a wide range of mid-sized logic designs without immediately requiring external memory.
• High I/O Density: 240 I/O pins provide flexibility to connect multiple peripherals and external devices directly to the FPGA fabric.
• Industrial Robustness: Rated for -40 °C to 100 °C operation, suitable for deployments where extended temperature range is required.
• Compact, Surface-Mount Packaging: 363-FBGA (17×17) FCBGA package enables dense PCB layouts while maintaining signal routing capabilities.
• Regulatory Compatibility: RoHS compliance supports environmentally conscious manufacturing and global market requirements.

Why Choose XC4VFX12-10SFG363I?

The XC4VFX12-10SFG363I positions itself as a practical, industrial-grade FPGA option for engineers needing a mid-sized logic fabric with substantial I/O and on-chip memory. Its combination of 12,312 logic elements, approximately 0.66 Mbits of embedded RAM, and 240 I/O pins makes it suitable for applications that require moderately complex custom logic, extensive peripheral connectivity, and operation across a wide temperature range.

Designed for board-level integration in a 363-FBGA surface-mount package and specified for a narrow core voltage range, this device is appropriate for developers and procurement teams seeking a dependable FPGA platform with clear electrical and environmental parameters for long-term projects.

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