XC4VFX12-11SFG363C

The XC4VFX12-11SFG363C is a Virtex®-4 FX field programmable gate array (FPGA) IC from AMD supplied in a 363‑FBGA/FCBGA package. It provides a balanced combination of programmable logic, embedded memory, and a high I/O count for commercial embedded designs.

With 12,312 logic elements, approximately 0.66 Mbits of on-chip RAM and 240 I/O, this device targets applications that need flexible custom logic, significant I/O connectivity and a compact, surface-mount package operating over a commercial temperature range.

Key Features

• Programmable Logic — 12,312 logic elements to implement custom digital functions and control logic within a single device.
• Embedded Memory — Approximately 0.66 Mbits (663,552 total RAM bits) of on-chip RAM to support buffering, temporary storage and logic state.
• I/O Capacity — 240 user I/O pins to support dense external interfacing and board-level connectivity requirements.
• Package — 363‑FBGA (363‑FCBGA) in a 17×17 package footprint for surface-mount PCB assembly and compact system integration.
• Power — Core supply voltage range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• Compliance — RoHS compliant, supporting environmental and regulatory preferences for lead-free assembly.

Typical Applications

• Custom Embedded Logic — Implement glue logic, protocol bridging or bespoke control functions using the device's 12,312 logic elements and on-chip RAM.
• I/O-Intensive Interfaces — Drive or monitor multiple parallel and serial interfaces leveraging 240 available I/O pins for board-level connectivity.
• Compact System Integration — Use the 363‑FCBGA (17×17) surface-mount package to integrate programmable logic into space-constrained commercial products.
• Commercial Electronic Products — Deploy in commercial-grade systems that operate within 0 °C to 85 °C and require RoHS-compliant components.

Unique Advantages

• High Logic Density: 12,312 logic elements provide substantial capability for implementing complex custom logic without external ASICs or CPLDs.
• On-Chip Memory: Approximately 0.66 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage needs.
• Generous I/O Count: 240 I/O pins simplify board design by enabling direct connections to multiple peripherals and interfaces.
• Compact, Surface-Mount Package: The 363‑FCBGA (17×17) package supports compact PCB layouts and modern assembly flows.
• Commercial Temperature Support: Rated for 0 °C to 85 °C operation to meet typical commercial product requirements.
• RoHS Compliant: Facilitates lead‑free manufacturing and helps meet environmental compliance goals.

Why Choose XC4VFX12-11SFG363C?

The XC4VFX12-11SFG363C combines a substantial logic resource, embedded memory and a high number of I/O in a compact 363‑FCBGA package, making it a practical choice for commercial embedded designs that require flexible, on-board programmable logic. Its defined core voltage range and commercial temperature rating enable predictable integration into standard system power and thermal environments.

Backed by AMD as the manufacturer and featuring RoHS compliance, this FPGA is suitable for engineering teams seeking a reliable, programmable solution with clear, verifiable specifications for logic capacity, memory and I/O connectivity.

Request a quote or submit an inquiry to obtain pricing and availability for the XC4VFX12-11SFG363C.