XC4VFX12-10SFG363C

The XC4VFX12-10SFG363C is a Virtex®-4 FX field programmable gate array (FPGA) in a 363-ball FCBGA package. It integrates programmable logic, on-chip embedded memory and a broad I/O count to support configurable digital designs.

With 12,312 logic elements, approximately 0.66 Mbits of embedded RAM, and 240 I/O pins, this commercial-grade FPGA targets designs that require moderate logic density, substantial on-chip memory and flexible connectivity within a surface-mount 363-FBGA (17×17) footprint.

Key Features

• Core Logic — 12,312 logic elements to implement custom digital logic and control functions.
• Embedded Memory — Approximately 0.66 Mbits (663,552 bits) of on-chip RAM for buffers, FIFOs and small data storage without external memory.
• I/O Capability — 240 user I/O pins to support multiple parallel interfaces and signal routing requirements.
• Power Supply — Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling defined power planning for system design.
• Package & Mounting — 363-FBGA (363-FCBGA, 17×17) surface-mount package for compact board-level integration.
• Operating Conditions — Commercial temperature range from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Embedded Processing — Use on-chip logic and embedded memory to implement custom processing blocks and control logic within compact systems.
• Interface Bridging — 240 I/O pins provide flexibility for bridging between multiple parallel or serial interfaces and custom protocol translation.
• Prototyping and System Integration — The surface-mount 363-FBGA package and substantial logic density make it suitable for development platforms and integration into production PCBs.

Unique Advantages

• Balanced Logic and Memory: 12,312 logic elements paired with approximately 0.66 Mbits of embedded RAM supports mixed logic and buffering needs without immediate dependence on external memory.
• High I/O Count: 240 user I/O pins give designers the ability to connect multiple peripherals, buses or custom interfaces on a single device.
• Compact Package: 363-FBGA (17×17) surface-mount packaging enables space-efficient board layouts for dense systems.
• Clear Power Envelope: Defined core voltage range (1.14 V–1.26 V) simplifies power supply selection and thermal planning.
• Commercial Temperature Rated: Rated for 0 °C to 85 °C operation to match standard commercial product requirements.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC4VFX12-10SFG363C?

The XC4VFX12-10SFG363C combines the Virtex®-4 FX architecture with a practical balance of logic capacity, embedded memory and I/O in a 363-FBGA surface-mount package. Its specifications make it well suited for designers needing configurable logic, on-chip RAM and a high I/O count within commercial temperature and power envelopes.

This part is appropriate for teams and projects that require a reproducible, RoHS-compliant FPGA solution that integrates moderate logic density and memory on a compact package for system-level integration and development.

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