XC4VFX12-11FFG668I

The XC4VFX12-11FFG668I is a Virtex®-4 FX Field Programmable Gate Array (FPGA) in a 668-ball FCBGA package. It provides a balance of configurable logic, embedded RAM, and a high I/O count for designs that require on-chip programmable logic resources.

This device delivers 12,312 logic elements, approximately 0.66 Mbits of embedded memory, and 320 I/Os, and it is supplied for operation across a 1.14 V to 1.26 V core voltage range. The part is specified for industrial temperature operation from −40 °C to 100 °C and is RoHS compliant.

Key Features

• Core Logic — 12,312 logic elements (CLBs equivalent) to implement custom digital logic and hardware-accelerated functions.
• Embedded Memory — Approximately 0.66 Mbits of on-chip RAM to support buffering, state storage, and scratchpad functions without external memory.
• I/O Capacity — 320 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Package & Mounting — 668-BBGA (668-FCBGA, 27×27) surface-mount package for compact board-level integration.
• Voltage Supply — Core supply range of 1.14 V to 1.26 V to match target power domains and design constraints.
• Temperature & Grade — Industrial-grade device specified for operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density programmable logic: Implement complex state machines, custom processing pipelines, and glue logic using 12,312 logic elements.
• I/O-intensive systems: Use the 320 I/Os to connect multiple parallel interfaces, expanders, or mixed-signal front ends without immediate need for external I/O expanders.
• Embedded memory buffering: Leverage approximately 0.66 Mbits of on-chip RAM for data buffering, FIFOs, and small working memories to reduce external memory dependence.
• Industrial-grade deployments: Operate reliably across −40 °C to 100 °C for applications requiring extended temperature range support.

Unique Advantages

• Balanced integration: Combines a substantial logic element count with embedded memory and high I/O in a single FCBGA package to reduce system complexity.
• Compact board footprint: The 668-FCBGA (27×27) surface-mount package enables dense PCB layouts while keeping functionality on-chip.
• Wide operating temperature: Industrial temperature range supports deployment in temperature-challenging environments without additional thermal qualification claims.
• Clear power domain requirements: Narrow core voltage range (1.14 V to 1.26 V) simplifies power-supply design and regulation for the FPGA core.
• Regulatory alignment: RoHS compliance supports designs targeting restricted-substance requirements.

Why Choose XC4VFX12-11FFG668I?

The XC4VFX12-11FFG668I positions itself as a capable Virtex®-4 FX FPGA option for engineers needing a mix of programmable logic, embedded memory, and a large I/O complement in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs where environmental range and regulatory alignment matter.

This device is well suited to projects that require up to 12,312 logic elements, approximately 0.66 Mbits of on-chip RAM, and 320 I/Os while maintaining a compact board footprint and clearly defined core power requirements.

Request a quote or submit an inquiry to obtain pricing and availability for XC4VFX12-11FFG668I and to discuss how it fits your next FPGA-based design.