XC4VFX12-11FFG668C

The XC4VFX12-11FFG668C is a Virtex®-4 FX Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 668-ball FCBGA (27×27) package for surface-mount assembly. This commercial-grade FPGA integrates 12,312 logic elements, approximately 0.664 Mbits of on-chip RAM, and 320 general-purpose I/O to support a wide range of configurable digital designs.

Designed for commercial temperature operation (0 °C to 85 °C) and RoHS-compliant, the device operates from a 1.14 V to 1.26 V core supply, making it suitable for embedded logic, I/O-intensive designs, and prototype-to-production deployments where compact, configurable hardware is required.

Key Features

• Core Logic 12,312 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
• Embedded Memory Approximately 0.664 Mbits (663,552 bits) of on-chip RAM for buffering, lookup tables, and small data storage needs.
• I/O Capacity 320 I/O pins support extensive external interfacing, enabling connectivity to sensors, peripherals, and multiple parallel buses.
• Power Core voltage range of 1.14 V to 1.26 V to match system power budgets and FPGA core requirements.
• Package & Mounting 668-FCBGA (27×27) surface-mount package provides a compact, high-pin-count solution for board-level integration.
• Operating Range & Compliance Commercial temperature grade (0 °C to 85 °C) and RoHS-compliant for environmentally conscious designs.

Typical Applications

• Custom Digital Logic Implement application-specific control, signal processing, or protocol logic using the FPGA’s programmable fabric and on-chip memory.
• I/O-Intensive Interfaces Support multiple parallel interfaces and peripherals with 320 available I/O pins for complex board-level connectivity.
• Embedded System Prototyping Rapidly prototype and validate system functions in commercial embedded products before production deployment.
• Data Buffering and Small-Scale Memory Tasks Use the on-chip RAM for buffering, temporary storage, and lookup functions within larger digital designs.

Unique Advantages

• High Configurability: 12,312 logic elements enable flexible implementation of a wide range of digital designs and control architectures.
• Integrated On-Chip Memory: Approximately 0.664 Mbits of embedded RAM reduces the need for external memory in many buffering and LUT applications.
• Extensive I/O Count: 320 I/O pins simplify board-level integration of multiple peripherals and parallel interfaces, minimizing additional logic routing.
• Compact High-Pin-Count Package: The 668-FCBGA (27×27) package delivers high connectivity in a space-efficient footprint for dense PCB layouts.
• Commercial Operation and Environmental Compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant to meet standard commercial product requirements.
• Predictable Power Window: A defined core voltage range (1.14 V to 1.26 V) supports consistent power design and supply planning.

Why Choose XC4VFX12-11FFG668C?

The XC4VFX12-11FFG668C offers a balanced combination of programmable logic density, on-chip memory, and a large I/O complement in a compact FCBGA package. Its commercial temperature rating and RoHS compliance make it appropriate for a wide range of embedded and board-level applications where configurable hardware and reliable interfacing are required.

This FPGA is well suited for teams and projects that require scalable, reprogrammable logic with substantial I/O capability and integrated memory—helpful for prototyping, custom digital functions, and I/O-driven system designs—backed by AMD manufacturing and industry-standard packaging.

Request a quote or submit an inquiry to receive pricing, availability, and further assistance for integrating the XC4VFX12-11FFG668C into your design.