XC4VFX100-11FFG1517I
| Part Description |
Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 768 6930432 94896 1517-BBGA, FCBGA |
|---|---|
| Quantity | 699 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 768 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 10544 | Number of Logic Elements/Cells | 94896 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6930432 |
Overview of XC4VFX100-11FFG1517I – Virtex®-4 FX FPGA, 1517-FCBGA (40×40), Industrial Grade
The XC4VFX100-11FFG1517I is a Virtex®-4 FX Field Programmable Gate Array (FPGA) IC designed for high-density, high-I/O digital designs. This device combines substantial logic capacity, embedded memory, and a large I/O count in a 1517-FCBGA surface-mount package targeted at industrial-temperature applications.
Its key value lies in delivering significant on-chip resources—logic, RAM and I/O—while supporting industrial operating temperatures and a narrow core voltage range for consistent system integration.
Key Features
- Core Logic Capacity Approximately 94,896 logic elements provide substantial programmable fabric for complex digital functions.
- Embedded Memory Approximately 6.93 Mbits of on-chip RAM to support buffering, FIFOs and embedded data storage without excessive external memory.
- I/O Density 768 user I/O pins for extensive interfacing with peripherals, sensors, and multi-channel systems.
- Power Core voltage supply range of 1.14 V to 1.26 V to match system power-rail requirements.
- Package & Mounting 1517-FCBGA (1517-BBGA) package, 40×40 mm, in a surface-mount form factor for compact, high-density PCB layouts.
- Operating Temperature Industrial temperature rating from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Environmental Compliance RoHS-compliant construction to meet environmental and manufacturing requirements.
Typical Applications
- High-density digital processing Use the large logic element count and embedded RAM for complex signal processing, protocol handling, and custom compute tasks.
- Multi-channel I/O systems Leverage 768 I/O pins to consolidate multiple interfaces or parallel channels on a single device.
- Industrial control and automation Industrial-grade temperature range and robust packaging support controllers, motor drives, and factory automation equipment.
- Embedded memory-intensive designs Approximately 6.93 Mbits of on-chip RAM reduces dependence on external memory for buffering and temporary storage.
Unique Advantages
- Highly integrated programmable fabric: Fewer external components required due to substantial on-chip logic and memory, simplifying BOM and board design.
- Extensive I/O capacity: 768 I/Os enable direct connection to numerous peripherals and sensors, reducing the need for external multiplexing devices.
- Industrial temperature support: Rated −40 °C to 100 °C for reliable operation in harsh or variable environments.
- Compact, high-density package: 1517-FCBGA (40×40) surface-mount package optimizes PCB real estate while supporting high pin counts.
- Controlled core voltage: Narrow supply range (1.14 V–1.26 V) helps ensure predictable core operation and simplifies power-supply design.
- RoHS compliant: Meets environmental manufacturing requirements for lead-free assembly.
Why Choose XC4VFX100-11FFG1517I?
The XC4VFX100-11FFG1517I positions itself as a high-capacity, industrial-grade FPGA solution for designs that demand a large number of logic elements, substantial embedded memory, and very high I/O counts. Its package and temperature rating make it suitable for compact, industrial systems where board space and environmental robustness matter.
Manufactured by AMD, this device is well suited for engineers building multi-channel controllers, complex digital processing blocks, and memory-intensive embedded systems that require consistent electrical and thermal characteristics across production runs.
Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for the XC4VFX100-11FFG1517I.

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