XC4VFX100-11FFG1152C
| Part Description |
Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 576 6930432 94896 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,384 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 576 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 10544 | Number of Logic Elements/Cells | 94896 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6930432 |
Overview of XC4VFX100-11FFG1152C – Virtex®-4 FX FPGA, 1152-FCBGA
The XC4VFX100-11FFG1152C is a Virtex®-4 FX Field Programmable Gate Array (FPGA) IC from AMD. It combines large programmable logic capacity with substantial on-chip memory and a high pin count in a 1152-FCBGA surface-mount package.
Key device characteristics include 94,896 logic elements, approximately 6.93 Mbits of embedded memory, 576 I/O, a supply voltage range of 1.14 V to 1.26 V, and commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Core Capacity 94,896 logic elements for implementing complex programmable logic designs.
- Embedded Memory Approximately 6.93 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
- I/O Density 576 I/O pins to support extensive external interfacing and parallel connectivity.
- Package & Mounting 1152-FCBGA (35×35) supplier device package, 1152-BBGA form factor, designed for surface-mount assembly.
- Power Supply Operates from 1.14 V to 1.26 V supply range.
- Operating Conditions Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- High-density programmable logic designs — Suited to implementations that require 94,896 logic elements and substantial on-chip memory.
- Multi-interface systems — 576 I/O supports integration of multiple external signals and bus interfaces.
- Embedded compute and buffering — Approximately 6.93 Mbits of embedded RAM supports local buffering and state retention within FPGA logic.
Unique Advantages
- Large programmable fabric: 94,896 logic elements provide capacity for complex algorithms and parallel logic blocks.
- Significant embedded memory: Approximately 6.93 Mbits of on-chip RAM reduces dependence on external memory for many designs.
- High I/O count: 576 I/O enables broad external connectivity without extensive multiplexing.
- Compact, high-density package: 1152-FCBGA (35×35) surface-mount package supports dense PCB integration.
- Commercial-grade operation and compliance: 0 °C to 85 °C operating range and RoHS compliance for standard commercial applications.
Why Choose XC4VFX100-11FFG1152C?
The XC4VFX100-11FFG1152C positions itself as a high-capacity, commercially graded FPGA solution that combines large logic resources, meaningful on-chip memory, and extensive I/O in a single 1152-FCBGA package. Its electrical and environmental specifications make it suitable for commercial applications that require substantial programmable logic and local memory within a surface-mount form factor.
Backed by AMD, this device offers a clear specification set—logic capacity, embedded RAM, I/O density, supply voltage range, and operating temperature—that helps designers evaluate fit for their FPGA-based systems and streamlines procurement and integration decisions.
Request a quote or submit an inquiry to receive pricing and availability information for the XC4VFX100-11FFG1152C.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








