XC4VFX100-11FFG1152C

IC FPGA 576 I/O 1152FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 576 6930432 94896 1152-BBGA, FCBGA

Quantity 1,384 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O576Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs10544Number of Logic Elements/Cells94896
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6930432

Overview of XC4VFX100-11FFG1152C – Virtex®-4 FX FPGA, 1152-FCBGA

The XC4VFX100-11FFG1152C is a Virtex®-4 FX Field Programmable Gate Array (FPGA) IC from AMD. It combines large programmable logic capacity with substantial on-chip memory and a high pin count in a 1152-FCBGA surface-mount package.

Key device characteristics include 94,896 logic elements, approximately 6.93 Mbits of embedded memory, 576 I/O, a supply voltage range of 1.14 V to 1.26 V, and commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Core Capacity 94,896 logic elements for implementing complex programmable logic designs.
  • Embedded Memory Approximately 6.93 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
  • I/O Density 576 I/O pins to support extensive external interfacing and parallel connectivity.
  • Package & Mounting 1152-FCBGA (35×35) supplier device package, 1152-BBGA form factor, designed for surface-mount assembly.
  • Power Supply Operates from 1.14 V to 1.26 V supply range.
  • Operating Conditions Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Compliance RoHS compliant.

Typical Applications

  • High-density programmable logic designs — Suited to implementations that require 94,896 logic elements and substantial on-chip memory.
  • Multi-interface systems — 576 I/O supports integration of multiple external signals and bus interfaces.
  • Embedded compute and buffering — Approximately 6.93 Mbits of embedded RAM supports local buffering and state retention within FPGA logic.

Unique Advantages

  • Large programmable fabric: 94,896 logic elements provide capacity for complex algorithms and parallel logic blocks.
  • Significant embedded memory: Approximately 6.93 Mbits of on-chip RAM reduces dependence on external memory for many designs.
  • High I/O count: 576 I/O enables broad external connectivity without extensive multiplexing.
  • Compact, high-density package: 1152-FCBGA (35×35) surface-mount package supports dense PCB integration.
  • Commercial-grade operation and compliance: 0 °C to 85 °C operating range and RoHS compliance for standard commercial applications.

Why Choose XC4VFX100-11FFG1152C?

The XC4VFX100-11FFG1152C positions itself as a high-capacity, commercially graded FPGA solution that combines large logic resources, meaningful on-chip memory, and extensive I/O in a single 1152-FCBGA package. Its electrical and environmental specifications make it suitable for commercial applications that require substantial programmable logic and local memory within a surface-mount form factor.

Backed by AMD, this device offers a clear specification set—logic capacity, embedded RAM, I/O density, supply voltage range, and operating temperature—that helps designers evaluate fit for their FPGA-based systems and streamlines procurement and integration decisions.

Request a quote or submit an inquiry to receive pricing and availability information for the XC4VFX100-11FFG1152C.

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