XC4VFX100-10FFG1152I

The XC4VFX100-10FFG1152I is a Virtex-4 FX series Field Programmable Gate Array (FPGA) provided in a 1152-ball FCBGA package. It delivers substantial on-chip logic and memory resources in a surface-mount, industrial-grade device.

With 94,896 logic elements, approximately 6.93 Mbits of embedded memory, and 576 user I/O pins, this device is engineered for designs that require high logic capacity, significant local memory, and dense I/O in a compact BGA footprint. It operates from a 1.14 V to 1.26 V supply and supports an operating temperature range of -40 °C to 100 °C.

Key Features

• Logic Capacity — 94,896 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 6.93 Mbits of on-chip RAM for buffering, data storage, and local memory needs without external memory dependency.
• I/O Resources — 576 user I/O pins to support dense connectivity and multiple peripheral interfaces.
• Power — Core voltage supply range of 1.14 V to 1.26 V for defined power planning and supply design.
• Package and Mounting — 1152-ball FCBGA (1152-FCBGA, 35×35) surface-mount package for a compact board-level footprint and robust board integration.
• Temperature and Grade — Industrial grade with an operating temperature range of -40 °C to 100 °C for demanding environments.
• Environmental Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

• High logic density: 94,896 logic elements enable implementation of complex algorithms and large-scale logic integration on a single device.
• Significant on-chip memory: Approximately 6.93 Mbits of embedded RAM reduces dependence on external memory and improves data access latency.
• Extensive I/O capability: 576 I/O pins allow for broad system connectivity and support for multiple high-pin-count interfaces.
• Industrial robustness: Rated for -40 °C to 100 °C operation to support designs deployed in extended-temperature environments.
• Compact BGA package: 1152-ball FCBGA (35×35) provides a space-efficient solution for high-density board layouts.
• Regulatory alignment: RoHS compliance simplifies environmental and manufacturing compliance efforts.

Why Choose XC4VFX100-10FFG1152I?

The XC4VFX100-10FFG1152I positions itself as a high-capacity, industrial-grade FPGA combining large logic resources, ample embedded memory, and high I/O density in a compact FCBGA package. These characteristics make it suitable for designs that require significant on-chip integration and reliable operation across a wide temperature range.

For engineering teams and procurement organizations building complex digital systems, this FPGA offers a balance of integration, predictable power requirements, and industry-standard packaging that supports scalable design development and long-term deployment.

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