XC4085XLA-09BG560I

FPGA, 3136 CLBS, 55000 GATES
Part Description

XC4000XLA/XV Field Programmable Gate Array (FPGA) IC 560-LBGA Exposed Pad, Metal

Quantity 471 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3136Number of Logic Elements/Cells7448
Number of Gates55000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits100352

Overview of XC4085XLA-09BG560I – XC4000XLA/XV FPGA, 560-LBGA Exposed Pad (Metal)

The XC4085XLA-09BG560I is a field programmable gate array (FPGA) in the XC4000XLA/XV family, featuring a balance of logic density, on-chip memory and high I/O count for industrial applications. Its combination of 7,448 logic elements, approximately 0.10 Mbits of embedded RAM and 404 I/Os supports complex, reconfigurable designs that require substantial interfacing and custom logic implementation.

Packaged in a 560-LBGA exposed pad metal package with surface-mount mounting and an operating range of -40 °C to 100 °C, this industrial-grade device is designed for deployment where robust thermal and environmental performance are required. The device operates from a 3 V to 3.6 V supply and is RoHS compliant.

Key Features

  • Core Logic — 3,136 logic blocks and 7,448 logic elements provide the programmable fabric needed for medium-complexity custom logic and state machines; roughly 55,000 equivalent gates enable comprehensive logic integration.
  • Embedded Memory — Total on-chip RAM of 100,352 bits (approximately 0.10 Mbits) supports local buffering, lookup tables and small data storage without immediate dependence on external memory.
  • I/O Capacity — 404 I/O pins give extensive connection options for peripherals, sensors, bus interfaces and custom I/O routing.
  • Package and Assembly — 560-LBGA exposed pad, metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm) with surface-mount mounting for industrial PCBs and thermal conduction through the exposed pad.
  • Power and Temperature — Operates from 3 V to 3.6 V and specified for an industrial operating temperature range of -40 °C to 100 °C, supporting deployment in demanding environments.
  • Regulatory Compliance — RoHS compliant, supporting environmental and materials compliance requirements.

Typical Applications

  • Industrial Control and Automation — Implement custom control logic, signal processing and I/O bridging with abundant logic elements and 404 I/Os, suitable for factory or process automation equipment.
  • Embedded System Integration — Use as a configurable glue logic and processing element in embedded platforms that require on-chip memory and flexible interfacing.
  • Communications and Networking — Deploy programmable protocol handling, interface translation and packet processing functions leveraging the device’s gate equivalent and I/O count.
  • Custom Logic Acceleration — Offload deterministic, latency-sensitive functions into FPGA fabric using available logic elements and embedded RAM for local data buffering.

Unique Advantages

  • High Logic Density: 7,448 logic elements and 3,136 logic blocks enable implementation of moderately complex digital systems without excessive external components.
  • On-chip RAM for Local Storage: Approximately 0.10 Mbits of embedded memory reduces the need for small external RAM in many control and buffering tasks.
  • Large I/O Count: 404 I/Os allow direct interfacing to numerous peripherals and buses, simplifying board-level connectivity and reducing external multiplexing.
  • Industrial Temperature Rating: Specified for -40 °C to 100 °C operation, supporting deployment in a wide range of industrial environments.
  • Robust Package Design: 560-LBGA exposed pad metal package with surface-mount mounting improves thermal conduction and supports reliable assembly on industrial PCBs.
  • Environmental Compliance: RoHS compliance supports environmental regulations and corporate sourcing requirements.

Why Choose XC4085XLA-09BG560I?

The XC4085XLA-09BG560I offers a practical combination of logic capacity, embedded memory and extensive I/O in a package and temperature rating suited for industrial applications. It is positioned for engineers who need configurable hardware resources and reliable thermal performance in mid-range FPGA designs.

As part of the XC4000XLA/XV family and manufactured by AMD, this device provides a scalable option for designs that require moderate gate counts, on-chip RAM and high I/O density while maintaining industrial temperature and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the XC4085XLA-09BG560I. Our team will assist with procuring the device and answering technical questions about suitability for your design.

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