XC4085XLA-09BG560I
| Part Description |
XC4000XLA/XV Field Programmable Gate Array (FPGA) IC 560-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 471 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 560-MBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 560-LBGA Exposed Pad, Metal | Number of I/O | 404 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3136 | Number of Logic Elements/Cells | 7448 | ||
| Number of Gates | 55000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 100352 |
Overview of XC4085XLA-09BG560I – XC4000XLA/XV FPGA, 560-LBGA Exposed Pad (Metal)
The XC4085XLA-09BG560I is a field programmable gate array (FPGA) in the XC4000XLA/XV family, featuring a balance of logic density, on-chip memory and high I/O count for industrial applications. Its combination of 7,448 logic elements, approximately 0.10 Mbits of embedded RAM and 404 I/Os supports complex, reconfigurable designs that require substantial interfacing and custom logic implementation.
Packaged in a 560-LBGA exposed pad metal package with surface-mount mounting and an operating range of -40 °C to 100 °C, this industrial-grade device is designed for deployment where robust thermal and environmental performance are required. The device operates from a 3 V to 3.6 V supply and is RoHS compliant.
Key Features
- Core Logic — 3,136 logic blocks and 7,448 logic elements provide the programmable fabric needed for medium-complexity custom logic and state machines; roughly 55,000 equivalent gates enable comprehensive logic integration.
- Embedded Memory — Total on-chip RAM of 100,352 bits (approximately 0.10 Mbits) supports local buffering, lookup tables and small data storage without immediate dependence on external memory.
- I/O Capacity — 404 I/O pins give extensive connection options for peripherals, sensors, bus interfaces and custom I/O routing.
- Package and Assembly — 560-LBGA exposed pad, metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm) with surface-mount mounting for industrial PCBs and thermal conduction through the exposed pad.
- Power and Temperature — Operates from 3 V to 3.6 V and specified for an industrial operating temperature range of -40 °C to 100 °C, supporting deployment in demanding environments.
- Regulatory Compliance — RoHS compliant, supporting environmental and materials compliance requirements.
Typical Applications
- Industrial Control and Automation — Implement custom control logic, signal processing and I/O bridging with abundant logic elements and 404 I/Os, suitable for factory or process automation equipment.
- Embedded System Integration — Use as a configurable glue logic and processing element in embedded platforms that require on-chip memory and flexible interfacing.
- Communications and Networking — Deploy programmable protocol handling, interface translation and packet processing functions leveraging the device’s gate equivalent and I/O count.
- Custom Logic Acceleration — Offload deterministic, latency-sensitive functions into FPGA fabric using available logic elements and embedded RAM for local data buffering.
Unique Advantages
- High Logic Density: 7,448 logic elements and 3,136 logic blocks enable implementation of moderately complex digital systems without excessive external components.
- On-chip RAM for Local Storage: Approximately 0.10 Mbits of embedded memory reduces the need for small external RAM in many control and buffering tasks.
- Large I/O Count: 404 I/Os allow direct interfacing to numerous peripherals and buses, simplifying board-level connectivity and reducing external multiplexing.
- Industrial Temperature Rating: Specified for -40 °C to 100 °C operation, supporting deployment in a wide range of industrial environments.
- Robust Package Design: 560-LBGA exposed pad metal package with surface-mount mounting improves thermal conduction and supports reliable assembly on industrial PCBs.
- Environmental Compliance: RoHS compliance supports environmental regulations and corporate sourcing requirements.
Why Choose XC4085XLA-09BG560I?
The XC4085XLA-09BG560I offers a practical combination of logic capacity, embedded memory and extensive I/O in a package and temperature rating suited for industrial applications. It is positioned for engineers who need configurable hardware resources and reliable thermal performance in mid-range FPGA designs.
As part of the XC4000XLA/XV family and manufactured by AMD, this device provides a scalable option for designs that require moderate gate counts, on-chip RAM and high I/O density while maintaining industrial temperature and RoHS compliance.
Request a quote or submit an inquiry to receive pricing and availability for the XC4085XLA-09BG560I. Our team will assist with procuring the device and answering technical questions about suitability for your design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








