XC4085XL-2BG432C

The XC4085XL-2BG432C is a Field Programmable Gate Array (FPGA) IC from AMD's XC4000E/X family. It delivers medium-density programmable logic with 7,448 logic elements and an I/O count of 352 in a compact 432-LBGA exposed pad package.

Designed for commercial-grade applications, this device combines on-chip memory, substantial gate count and a dense I/O footprint while operating from a 3.0 V to 3.6 V supply and within a 0 °C to 85 °C temperature range.

Key Features

• Core Logic Implements 7,448 logic elements to support a range of medium-complexity digital designs; total gate count is 85,000.
• Embedded Memory Includes 100,352 bits of on-chip RAM (approximately 0.10 Mbits) to support buffering, state storage and small lookup tables without external memory.
• I/O Density Provides 352 user I/O pins for parallel interfaces, bus bridging and high-pin-count connectivity.
• Package and Mounting Supplied in a 432-LBGA exposed pad metal package (supplier device package: 432-MBGA, 40×40) optimized for surface-mount assembly.
• Power Operates from a 3.0 V to 3.6 V supply range to align with common commercial logic rails.
• Operating Range Commercial grade device rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance RoHS compliant, meeting common materials restrictions for commercial electronic products.

Typical Applications

• Custom digital logic — Implements medium-complexity state machines, address decoding and protocol processing using the device's 7,448 logic elements and 85,000 gates.
• I/O-intensive interfaces — Handles parallel buses and multiple peripheral interfaces with 352 available I/O pins.
• On-chip buffering and control — Uses approximately 0.10 Mbits of embedded RAM for small FIFO buffers, configuration tables and local storage without external memory.
• Compact board-level integration — 432-LBGA package and surface-mount mounting allow dense PCB designs where board space and I/O density are priorities.

Unique Advantages

• High logic density: 7,448 logic elements provide the capacity to implement medium-complexity digital functions without occupying multiple discrete components.
• Large I/O count: 352 I/Os simplify external connectivity and reduce the need for additional interface chips.
• Integrated on-chip RAM: 100,352 bits of embedded memory enable local buffering and state retention, reducing external memory dependency.
• Compact BGA package: 432-LBGA exposed pad metal package delivers a high pin-count footprint in a board-friendly form factor.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to match typical commercial deployments.
• RoHS compliant: Conforms to common environmental material requirements for commercial electronics manufacturing.

Why Choose XC4085XL-2BG432C?

The XC4085XL-2BG432C offers a balanced combination of logic capacity, on-chip memory and extensive I/O in a compact 432-LBGA package, suited for commercial designs that require medium-density programmable logic. Its 3.0 V–3.6 V supply range and 0 °C–85 °C rating make it appropriate for a wide range of board-level applications where integration and I/O count are priorities.

Engineers and procurement teams looking for an AMD XC4000E/X-series FPGA with substantial embedded resources and a high pin count will find this device a practical option for reducing component count and simplifying board-level integration while meeting RoHS requirements.

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