XC4085XL-3BG560I

The XC4085XL-3BG560I is an AMD XC4000E/X series Field Programmable Gate Array (FPGA) in a 560-ball L-BGA package with exposed pad and metal heat-spreader. It delivers a compact, industrial-grade FPGA solution with a high I/O count and on-chip memory suitable for temperature-demanding applications.

Designed for systems requiring flexible, reconfigurable logic, the device combines 7,448 logic elements, approximately 0.10 Mbits of embedded RAM, and up to 448 user I/O pins, all operating from a 3.0 V to 3.6 V supply and rated for −40 °C to 100 °C.

Key Features

• Core Logic — 7,448 logic elements and approximately 85,000 gates provide capacity for custom digital designs and complex combinational/sequential logic.
• Embedded Memory — 100,352 total RAM bits (approximately 0.10 Mbits) available for on-chip buffering, state storage, and small data structures.
• I/O Density — Up to 448 user I/O pins to support interface-rich board designs and multiple peripheral connections.
• Power — Single-supply operation from 3.0 V to 3.6 V simplifies power rail planning for mixed-voltage systems.
• Package — 560-LBGA exposed pad, metal package (supplier device package: 560-MBGA, 42.5 × 42.5 mm) for a compact board footprint and thermal conduction.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for reliable performance in temperature-challenging environments.
• Mounting & Compliance — Surface-mount device with RoHS compliance to meet modern manufacturing and environmental requirements.

Typical Applications

• Industrial Control Systems — High I/O count and industrial temperature rating make this FPGA suitable for control logic, protocol bridging, and real-time interfacing in factory equipment.
• Communications & Interface Bridging — Large number of user I/Os and significant gate/logic element capacity allow implementation of custom interface logic and protocol translation.
• Embedded System Prototyping — Reconfigurable logic and on-chip RAM support rapid development of custom digital functions and system validation.

Unique Advantages

• High I/O Count for Interface-Dense Designs: 448 user I/Os enable direct connection to numerous peripherals and external subsystems without extensive external glue logic.
• Balanced Logic and Memory Resources: 7,448 logic elements paired with approximately 0.10 Mbits of embedded RAM support a wide range of control, buffering, and state-machine implementations.
• Industrial-Grade Thermal Range: −40 °C to 100 °C rating provides predictable operation in demanding temperature environments common to industrial equipment.
• Compact, Thermally-Conscious Packaging: 560-LBGA with exposed pad and metal construction (42.5 × 42.5 mm) helps manage board space while supporting thermal conduction.
• RoHS Compliant and Surface-Mount Ready: Designed for modern manufacturing flows and environmental requirements, simplifying assembly and compliance.

Why Choose XC4085XL-3BG560I?

The XC4085XL-3BG560I positions itself as a practical, industrial-grade FPGA option combining a substantial logic element count, ample I/O, and on-chip RAM in a compact 560-LBGA package. Its operating voltage range of 3.0 V to 3.6 V and wide temperature rating make it suitable for deployed systems that must balance configurability with environmental robustness.

This device is a strong fit for engineers and procurement teams building interface-dense industrial systems, communications bridging modules, or embedded prototypes that require reconfigurable digital resources while maintaining compact board integration and RoHS-compliant manufacturing.

Request a quote or submit an inquiry to obtain pricing, availability, and additional purchasing information for the XC4085XL-3BG560I.