XC4085XL-09BG432C

The XC4085XL-09BG432C is an XC4000E/X series Field Programmable Gate Array (FPGA) IC from AMD, offered in a 432-LBGA exposed-pad metal package. It provides 7,448 logic elements, approximately 0.10 Mbits of embedded RAM, and up to 352 I/O pins for designs that require substantial programmable logic and I/O capacity.

Built for commercial-grade applications, the device operates from a 3.0 V to 3.6 V supply and across a 0 °C to 85 °C operating range, and is RoHS compliant.

Key Features

• Logic Capacity  7,448 logic elements provide the core programmable fabric for implementing custom digital logic functions.
• Embedded Memory  Approximately 0.10 Mbits (100,352 bits) of on-chip RAM to support buffering, state storage, and small data structures.
• I/O Density  Up to 352 I/O pins enable high connectivity for interfacing with multiple peripherals, buses, and external devices.
• Gate Equivalent  Approximately 85,000 gates for estimating integration density and design partitioning.
• Package & Mounting  432-LBGA exposed pad, metal package (supplier device package: 432-MBGA, 40×40) in a surface-mount form factor for compact board-level integration.
• Power  Operates from a 3.0 V to 3.6 V supply range to match common commercial logic rails.
• Temperature Rating  Commercial operating range from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑density I/O systems  Designs that require large numbers of external connections can leverage the XC4085XL-09BG432C’s 352 I/O pins for flexible interfacing.
• Custom logic and glue logic  Use the 7,448 logic elements to implement glue logic, protocol adaptation, and custom state machines.
• Embedded buffering and small data structures  On-chip RAM (100,352 bits) supports buffering, FIFOs, and small lookup tables within the FPGA fabric.

Unique Advantages

• High I/O count: 352 I/O pins reduce the need for external multiplexers or expanders, simplifying board-level connectivity.
• Balanced logic and memory: 7,448 logic elements paired with approximately 0.10 Mbits of RAM enable compact implementations of control, processing, and buffering functions.
• Compact, solderable package: 432-LBGA exposed-pad metal package in a 40×40 supplier footprint supports dense, surface-mount designs.
• Commercial-grade operation: Rated for 0 °C to 85 °C operation and a 3.0 V–3.6 V supply range for standard commercial applications.
• Regulatory compliance: RoHS compliance supports environmentally conscious design requirements.
• Established manufacturer: Produced by AMD, providing a recognized vendor source for FPGA components.

Why Choose XC4085XL-09BG432C?

The XC4085XL-09BG432C offers a balanced mid-range FPGA option with substantial I/O, moderate logic capacity, and on-chip RAM in a compact 432‑LBGA package. Its combination of 7,448 logic elements, 352 I/O, and approximately 0.10 Mbits of embedded memory makes it suitable for commercial designs that need flexible programmable logic and dense interfacing without excessive board area.

Backed by AMD as the manufacturer, this device is appropriate for designers and procurement teams seeking a commercial-grade FPGA option that aligns with standard 3.0 V–3.6 V systems and RoHS requirements.

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