XC4062XL-3HQ240C0624

The XC4062XL-3HQ240C0624 is a Field Programmable Gate Array (FPGA) IC from AMD, part of the XC4000E/X family. It provides 5,472 logic elements, approximately 73,728 bits of on-chip RAM, 193 programmable I/O pins and an estimated 40,000 gates in a 240-BFQFP exposed pad package.

Designed for commercial applications, the device operates from a 3 V to 3.6 V supply and across an ambient temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic 5,472 logic elements (cells) and approximately 40,000 gates provide a programmable resource base for implementing custom digital functions.
• On-Chip Memory Approximately 73,728 bits of embedded RAM for state storage, buffering, and small lookup tables directly on the FPGA fabric.
• I/O Capacity 193 I/O pins to support interfacing with external peripherals, buses, and sensors.
• Package and Mounting 240-BFQFP exposed pad (240-PQFP, 32×32 footprint) in a surface-mount configuration for board-level integration and thermal conduction through the exposed pad.
• Power Single-supply operation from 3 V to 3.6 V suitable for common commercial voltage domains.
• Operating Range & Grade Commercial grade operation with ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom Programmable Logic Implement combinational and sequential logic using 5,472 logic elements and on-chip RAM to consolidate discrete logic functions.
• Interface and Glue Logic Use 193 I/O pins to bridge and customize interfaces between processors, memory, and peripheral devices.
• Prototyping and Development Evaluate and iterate hardware designs on a commercial-grade FPGA with ample logic density and embedded RAM.

Unique Advantages

• Substantial Logic Density: 5,472 logic elements enable implementation of complex custom logic without immediate need for multiple discrete components.
• Integrated Memory Resources: Approximately 73,728 bits of on-chip RAM reduce reliance on external memory for small buffers and state storage.
• High I/O Count: 193 I/O pins provide flexibility for multiple peripheral connections and complex board-level interfacing.
• Board-Level Thermal Option: Exposed pad in the 240-BFQFP package facilitates board-level thermal management and secure mounting.
• Commercial Voltage Compatibility: 3 V to 3.6 V supply range matches common commercial power rails for straightforward integration.

Why Choose XC4062XL-3HQ240C0624?

The XC4062XL-3HQ240C0624 combines a substantial array of logic elements, embedded RAM, and a high I/O count in a single commercial-grade FPGA package. Its 240-BFQFP exposed pad package provides a practical footprint and thermal option for PCB designs that require consolidated programmable logic.

This device is well suited to designers and procurement teams seeking a commercially graded FPGA with clear, verifiable resources—logic, memory, I/O, and package specifications—that simplify component selection and board-level planning.

Request a quote or submit an inquiry to obtain pricing and availability for the XC4062XL-3HQ240C0624.