XC4062XL-3HQ240C
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 193 73728 5472 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 441 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 193 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2304 | Number of Logic Elements/Cells | 5472 | ||
| Number of Gates | 62000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of XC4062XL-3HQ240C – XC4000E/X FPGA, 5,472 logic elements, 240-BFQFP Exposed Pad
The XC4062XL-3HQ240C is a Field Programmable Gate Array (FPGA) device from AMD's XC4000E/X family. It provides a mid-range programmable logic resource set suitable for designs that require on-chip logic, embedded RAM, and a large set of general-purpose I/O.
With 5,472 logic elements, approximately 73,728 bits of embedded RAM, and 193 I/O pins in a 240-BFQFP exposed pad package, this commercial-grade FPGA targets applications that need a balance of logic capacity, memory, and I/O density while operating from a 3.0–3.6 V supply within a 0 °C to 85 °C temperature range.
Key Features
- Logic Capacity Provides 5,472 logic elements to implement combinational and sequential logic functions for mid-range programmable designs.
- Configurable Logic Blocks 2304 CLBs (as specified) to structure and organize logic resources across the device.
- Embedded Memory Approximately 73,728 bits of on-chip RAM to store state, buffers, and small data structures without external memory.
- I/O and Gate Count 193 user I/O pins and an estimated 62,000 gates for interfacing and implementing complex logic networks.
- Power and Operating Range Operates from a 3.0 V to 3.6 V supply and is rated for commercial temperature operation from 0 °C to 85 °C.
- Package and Mounting 240-BFQFP exposed pad package (supplier package: 240-PQFP 32×32) in a surface-mount form factor for PCB assembly and thermal handling.
- Compliance RoHS-compliant, supplied as a commercial-grade FPGA.
Typical Applications
- Interface and Glue Logic Use the device to implement protocol bridging, signal conditioning, and custom interface logic where 193 I/O and a mid-range logic count are required.
- Control and Sequencing Implement finite-state machines, control paths, and timing sequences using the available logic elements and on-chip RAM for state storage.
- Prototyping and Development Suitable for evaluating custom logic architectures and proof-of-concept designs that benefit from reprogrammability and moderate memory resources.
Unique Advantages
- Balanced Logic and Memory: 5,472 logic elements paired with approximately 73,728 bits of embedded RAM allow implementation of both control logic and local data storage without external components.
- High I/O Count: 193 I/O pins provide broad connectivity for sensor interfaces, bus connections, and parallel peripherals, reducing the need for external I/O expanders.
- Packaged for Surface Mount Assembly: 240-BFQFP exposed pad package supports standard surface-mount assembly processes and PCB-level thermal management.
- Commercial-Grade Availability: Designed for commercial temperature ranges (0 °C to 85 °C) and RoHS compliance to meet common production and regulatory needs.
- Standard Supply Voltage: Operates from 3.0 V to 3.6 V, aligning with common system power rails for straightforward integration.
Why Choose XC4062XL-3HQ240C?
The XC4062XL-3HQ240C positions itself as a practical, commercial-grade FPGA for engineers seeking a mid-range programmable solution with a balanced mix of logic, embedded RAM, and extensive I/O. Its 240-BFQFP exposed pad package and surface-mount mounting type facilitate PCB integration and thermal handling in production designs.
This device is well suited to teams developing control logic, interface bridging, or prototype systems that require reconfigurability, on-chip memory, and a significant number of I/O pins, while operating from standard 3.0–3.6 V rails within commercial temperature limits.
Request a quote or submit an inquiry for pricing and availability of the XC4062XL-3HQ240C to move your design forward.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








