XC4062XL-3HQ240C

IC FPGA 193 I/O 240QFP
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 193 73728 5472 240-BFQFP Exposed Pad

Quantity 441 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O193Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2304Number of Logic Elements/Cells5472
Number of Gates62000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of XC4062XL-3HQ240C – XC4000E/X FPGA, 5,472 logic elements, 240-BFQFP Exposed Pad

The XC4062XL-3HQ240C is a Field Programmable Gate Array (FPGA) device from AMD's XC4000E/X family. It provides a mid-range programmable logic resource set suitable for designs that require on-chip logic, embedded RAM, and a large set of general-purpose I/O.

With 5,472 logic elements, approximately 73,728 bits of embedded RAM, and 193 I/O pins in a 240-BFQFP exposed pad package, this commercial-grade FPGA targets applications that need a balance of logic capacity, memory, and I/O density while operating from a 3.0–3.6 V supply within a 0 °C to 85 °C temperature range.

Key Features

  • Logic Capacity  Provides 5,472 logic elements to implement combinational and sequential logic functions for mid-range programmable designs.
  • Configurable Logic Blocks  2304 CLBs (as specified) to structure and organize logic resources across the device.
  • Embedded Memory  Approximately 73,728 bits of on-chip RAM to store state, buffers, and small data structures without external memory.
  • I/O and Gate Count  193 user I/O pins and an estimated 62,000 gates for interfacing and implementing complex logic networks.
  • Power and Operating Range  Operates from a 3.0 V to 3.6 V supply and is rated for commercial temperature operation from 0 °C to 85 °C.
  • Package and Mounting  240-BFQFP exposed pad package (supplier package: 240-PQFP 32×32) in a surface-mount form factor for PCB assembly and thermal handling.
  • Compliance  RoHS-compliant, supplied as a commercial-grade FPGA.

Typical Applications

  • Interface and Glue Logic  Use the device to implement protocol bridging, signal conditioning, and custom interface logic where 193 I/O and a mid-range logic count are required.
  • Control and Sequencing  Implement finite-state machines, control paths, and timing sequences using the available logic elements and on-chip RAM for state storage.
  • Prototyping and Development  Suitable for evaluating custom logic architectures and proof-of-concept designs that benefit from reprogrammability and moderate memory resources.

Unique Advantages

  • Balanced Logic and Memory: 5,472 logic elements paired with approximately 73,728 bits of embedded RAM allow implementation of both control logic and local data storage without external components.
  • High I/O Count: 193 I/O pins provide broad connectivity for sensor interfaces, bus connections, and parallel peripherals, reducing the need for external I/O expanders.
  • Packaged for Surface Mount Assembly: 240-BFQFP exposed pad package supports standard surface-mount assembly processes and PCB-level thermal management.
  • Commercial-Grade Availability: Designed for commercial temperature ranges (0 °C to 85 °C) and RoHS compliance to meet common production and regulatory needs.
  • Standard Supply Voltage: Operates from 3.0 V to 3.6 V, aligning with common system power rails for straightforward integration.

Why Choose XC4062XL-3HQ240C?

The XC4062XL-3HQ240C positions itself as a practical, commercial-grade FPGA for engineers seeking a mid-range programmable solution with a balanced mix of logic, embedded RAM, and extensive I/O. Its 240-BFQFP exposed pad package and surface-mount mounting type facilitate PCB integration and thermal handling in production designs.

This device is well suited to teams developing control logic, interface bridging, or prototype systems that require reconfigurability, on-chip memory, and a significant number of I/O pins, while operating from standard 3.0–3.6 V rails within commercial temperature limits.

Request a quote or submit an inquiry for pricing and availability of the XC4062XL-3HQ240C to move your design forward.

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