XC4062XL-2HQ240I

The XC4062XL-2HQ240I is an AMD XC4000E/X series Field Programmable Gate Array (FPGA) supplied in a 240-BFQFP exposed pad package. It integrates a substantial logic fabric and on-chip memory alongside a high I/O count to address mid-density programmable logic needs.

With 5,472 logic elements, 73,728 bits of embedded RAM, 193 I/O pins, a 3.0–3.6 V supply range, and an industrial operating range of −40 °C to 100 °C, this device targets designs that require moderate logic density, significant I/O, and wide temperature tolerance.

Key Features

• Core / Logic Density  Provides 5,472 logic elements to implement custom combinational and sequential logic functions for mid-density FPGA designs.
• Logic Blocks  Includes 2,304 logic blocks for organized mapping of functions across the device.
• Embedded Memory  73,728 bits of on-chip RAM (approximately 0.074 Mbits) to support buffering, state storage, and small lookup tables without external memory.
• I/O Count  193 I/O pins to support extensive peripheral interfacing and multiple parallel buses.
• Power  Operates from a 3.0 V to 3.6 V supply range, compatible with common 3.3 V system rails.
• Package & Mounting  240-BFQFP exposed pad package (240-PQFP, 32×32) in a surface-mount form factor for PCB assembly and thermal conduction through the exposed pad.
• Operating Range & Grade  Industrial grade operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Device Scale  Approximately 62,000 gates to indicate overall logic capacity for system partitioning and design planning.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial Control  Suitable for control and automation designs that require 193 I/O lines and an industrial temperature range (−40 °C to 100 °C).
• Communication Interfaces  Can implement parallel and serial interface logic using the device’s high I/O count and embedded RAM for buffering.
• Custom Peripheral Glue Logic  Use the 5,472 logic elements to consolidate discrete logic, interface converters, and timing-critical glue functions into a single programmable device.
• Prototyping and Medium-Density FPGA Designs  Provides a balance of logic resources and on-chip memory for proof-of-concept and production designs requiring moderate complexity.

Unique Advantages

• High I/O Count: 193 I/O pins enable broad peripheral connectivity and parallel bus implementations without external I/O expanders.
• Integrated On-Chip RAM: 73,728 bits of embedded memory reduce dependence on external RAM for small buffers and lookup tables, simplifying BOM and layout.
• Industrial Temperature Capability: Rated for −40 °C to 100 °C operation to support deployment in temperature-challenging environments.
• Standard 3.3 V Supply Compatibility: Operates from 3.0 V to 3.6 V, aligning with common 3.3 V system rails for straightforward power integration.
• Surface-Mount 240-BFQFP Package: Exposed pad package in a 32×32 footprint facilitates PCB assembly and thermal management via the exposed pad.
• RoHS Compliant: Helps meet regulatory and environmental requirements for lead-free manufacturing.

Why Choose XC4062XL-2HQ240I?

The XC4062XL-2HQ240I combines mid-range programmable logic density with significant I/O and on-chip memory in a surface-mount 240-BFQFP exposed pad package. Its electrical and environmental specifications — 3.0–3.6 V supply and an industrial −40 °C to 100 °C temperature range — make it suitable for designs that require robust operation across varying conditions.

This device is well suited for teams and designs that need to consolidate discrete logic, implement custom interfaces, or prototype medium-complexity FPGA solutions while maintaining a compact package and RoHS compliance. Its balance of logic elements, embedded RAM, and extensive I/O supports scalable implementations with clear BOM and PCB layout benefits.

Request a quote or submit a pricing and availability inquiry to receive more information about the XC4062XL-2HQ240I and how it fits your design requirements.