XC4062XL-2BG432I

The XC4062XL-2BG432I is an AMD XC4000E/X family field programmable gate array (FPGA) designed for industrial-grade embedded logic applications. It provides a balanced combination of logic capacity, on-chip memory, and high I/O density in a compact 432-LBGA exposed-pad package.

Targeted at industrial and embedded systems, the device supports supply voltages from 3 V to 3.6 V and an operating range of -40 °C to 100 °C, making it suitable for designs requiring extended temperature operation and surface-mount, high-density packaging.

Key Features

• Logic Capacity — Provides 2,304 CLBs and 5,472 logic elements to implement custom digital logic and control functions.
• Embedded Memory — Includes 73,728 bits of on-chip RAM, approximately 0.074 Mbits of embedded memory for buffering, state storage, and small data structures.
• I/O Density — Offers 352 user I/O pins to support multiple interfaces, parallel buses, and external peripheral connections.
• Gate Count — Equivalent to 62,000 gates for mapping larger combinational and sequential designs.
• Package and Mounting — Supplied in a 432-LBGA exposed-pad, metal package (432-MBGA, 40×40) for surface-mount PCB assembly and thermal management.
• Power and Temperature — Operates from 3 V to 3.6 V and across an industrial temperature range of -40 °C to 100 °C.
• Environmental Compliance — RoHS compliant for regulated manufacturing environments.

Typical Applications

• Industrial Control — Implement custom control logic and deterministic processing in equipment that requires industrial temperature operation.
• Dense I/O Systems — Use the 352 I/O pins for protocol bridging, parallel sensor arrays, and multi-channel interfacing where high pin count is needed.
• Embedded Logic and Acceleration — Leverage 5,472 logic elements and on-chip RAM for hardware-accelerated routines, state machines, and function offload.
• Compact, Surface-Mount Designs — Ideal for space-constrained PCBs that benefit from a 40×40 432-MBGA package with exposed pad for improved thermal performance.

Unique Advantages

• High logic and gate density: 2,304 CLBs and approximately 62,000 gates enable complex logic integration without external ASICs or CPLDs.
• Substantial on-chip RAM: 73,728 bits of embedded memory support buffering and small data structures, reducing external memory needs.
• Extensive I/O resources: 352 I/O pins accommodate multiple peripherals and parallel interfaces, simplifying board-level routing.
• Industrial temperature range: Rated from -40 °C to 100 °C for deployment in environments requiring extended temperature capability.
• Compact, thermally conscious package: 432-LBGA exposed pad (432-MBGA, 40×40) supports surface-mount assembly and helps with heat dissipation in high-density designs.
• Regulatory compatibility: RoHS compliance aligns with modern manufacturing and environmental requirements.

Why Choose XC4062XL-2BG432I?

The XC4062XL-2BG432I positions itself as a robust industrial FPGA solution that combines moderate-to-high logic density, useful on-chip memory, and extensive I/O in a compact LBGA package. Its supply voltage range and extended operating temperature make it suitable for embedded and industrial designs that require reliable operation across varied conditions.

This device is a practical choice for engineers seeking to consolidate control, interfacing, and custom logic into a single programmable component while maintaining a small board footprint and RoHS-compliant manufacturing compatibility.

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