XC4062XL-3HQ240I

The XC4062XL-3HQ240I is an AMD XC4000E/X family Field Programmable Gate Array (FPGA) in a 240-BFQFP exposed pad package. It combines a mid-range logic capacity with substantial I/O and embedded RAM to implement custom digital logic, interface aggregation, and control functions.

Designed for surface-mount assembly and industrial operating conditions, the device supports a 3.0–3.6 V supply and an operating temperature range of −40 °C to 100 °C, making it suitable for applications that require robust thermal and environmental performance within that specified range.

Key Features

• Logic Capacity — Provides 2304 logic blocks corresponding to 5,472 logic elements and approximately 62,000 equivalent gates for implementing medium-complexity digital designs.
• Embedded Memory — Includes 73,728 bits of on-chip RAM (approximately 0.074 Mbits) to support registers, FIFOs, and small data buffers without external memory.
• I/O Density — High pin count with 193 user I/O pins to accommodate multi-channel interfaces, parallel buses, and extensive signal routing.
• Package and Thermal — 240-BFQFP exposed pad package (supplier device package: 240-PQFP 32×32) in a surface-mount form factor for PCB designs requiring controlled footprint and thermal dissipation.
• Power — Operates from a 3.0 V to 3.6 V supply range to integrate with common system power rails.
• Industrial Temperature Grade — Specified for −40 °C to 100 °C operation to address thermally demanding environments.
• Mounting and Assembly — Surface mount package suitable for automated PCB assembly processes.

Typical Applications

• Industrial Control — Implement custom control logic, I/O aggregation, and sensor interfacing within the device’s industrial temperature and voltage ranges.
• Embedded Systems — Serve as the programmable core for embedded designs that require medium-density logic and on-chip RAM for buffering and state storage.
• Prototyping and Development — Rapidly iterate and validate digital designs using the device’s programmable logic and abundant I/O.
• I/O-Intensive Interfaces — Act as a bridge or glue logic component for systems needing many parallel or mixed-signal interfaces routed through numerous I/O pins.

Unique Advantages

• Balanced Logic and Memory — The combination of 5,472 logic elements and 73,728 bits of embedded RAM provides a good balance for designs that need both logic density and on-chip storage.
• High I/O Count — 193 I/O pins reduce the need for external multiplexing and simplify board-level routing for multi-signal applications.
• Industrial Temperature Range — Specified operation from −40 °C to 100 °C supports deployment in thermally challenging environments within the given limits.
• Robust Packaging — 240-BFQFP exposed pad and 240-PQFP (32×32) supplier package support reliable surface-mount assembly and thermal management through the exposed pad.
• Standard Power Domain — 3.0–3.6 V supply compatibility aligns with common system power rails for straightforward integration.

Why Choose XC4062XL-3HQ240I?

The XC4062XL-3HQ240I positions itself as a practical, industrial-grade FPGA option where moderate logic density, substantial I/O, and embedded RAM are required. Its package and thermal characteristics, combined with the specified operating temperature and supply range, make it suitable for engineers building robust embedded and control systems.

This device is well suited to teams and designs that need a programmable hardware platform with clear capacity metrics—logic elements, on-chip RAM, and I/O count—backed by AMD’s XC4000E/X family heritage for straightforward integration into mid-range digital designs.

Request a quote or submit an inquiry today to receive pricing and availability for the XC4062XL-3HQ240I and to discuss how it can meet your project’s programmable logic requirements.