XC4085XL-09BG560C

The XC4085XL-09BG560C is a commercial-grade Field Programmable Gate Array (FPGA) IC by AMD, provided in a 560-ball low-profile BGA with exposed pad and metal heat spreader. It delivers a balanced combination of logic capacity, on-chip memory, and high I/O count for commercial embedded designs and custom digital logic implementations.

Key Features

• Core Logic Approximately 7,448 logic elements supporting up to 85,000 gates for mid-range digital integration and custom logic functions.
• Embedded Memory Approximately 0.100 Mbits (100,352 bits) of on-chip RAM to support buffers, FIFOs, and local storage for logic blocks.
• I/O Density Up to 448 user I/O pins, enabling high pin-count interfaces and complex system interconnects.
• Package 560-LBGA exposed pad, metal finish in a 560-MBGA (42.5 × 42.5 mm) package suitable for surface-mount assembly and compact board layouts.
• Power Operates from a 3.0 V to 3.6 V supply range, compatible with common commercial power rails.
• Operating Range Specified for commercial temperature operation from 0 °C to 85 °C.
• Mounting Surface-mount package designed for PCB assembly with an exposed pad for thermal conduction.
• Compliance RoHS compliant.

Typical Applications

• High‑density I/O systems — Use the 448 I/O pins for complex interfacing, board-level glue logic, and multi-channel signal routing in commercial equipment.
• Mid-range digital integration — Leverage ~7,448 logic elements and 85,000 gates to consolidate discrete logic and small-scale processors into a single FPGA.
• Embedded memory-dependent functions — On-chip RAM (100,352 bits) supports buffering, protocol handling, and localized data storage for embedded applications.
• Compact surface-mount designs — The 560-LBGA package with exposed pad enables dense PCB layouts while providing thermal conduction for commercial assemblies.

Unique Advantages

• High I/O capacity: 448 user I/Os allow extensive peripheral connectivity without external I/O expanders.
• Balanced logic and gate count: ~7,448 logic elements and 85,000 gates provide a practical balance of integration for mid-level designs.
• On-chip RAM: 100,352 bits of embedded memory reduce dependence on external RAM for many control and buffering tasks.
• Compact BGA package: 560-LBGA (42.5 × 42.5 mm) enables high-density board designs while the exposed pad supports thermal management.
• Commercial-grade operation: Specified for 0 °C to 85 °C operation and a 3.0–3.6 V supply range for standard commercial environments.
• RoHS compliance: Meets common lead-free assembly and environmental standards.

Why Choose XC4085XL-09BG560C?

The XC4085XL-09BG560C positions itself as a commercial FPGA option that combines mid-range logic capacity, meaningful on-chip RAM, and very high I/O count in a compact 560-LBGA footprint. It is suited to designers seeking to consolidate logic, interfaces, and buffering into a single device while maintaining compatibility with standard commercial power and temperature conditions.

This device is a fit for engineering teams working on commercial embedded systems, board-level interface consolidation, and mid-complexity digital designs that require a blend of I/O density and local memory. Its package and thermal provisions help integrate the FPGA into compact, surface-mounted assemblies for reliable operation within the specified commercial range.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC4085XL-09BG560C for your next commercial FPGA design.