XC4VFX20-10FFG672I

IC FPGA 320 I/O 672FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 320 1253376 19224 672-BBGA, FCBGA

Quantity 120 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O320Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2136Number of Logic Elements/Cells19224
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1253376

Overview of XC4VFX20-10FFG672I – Virtex®-4 FX Field Programmable Gate Array (672-FCBGA)

The XC4VFX20-10FFG672I is a Virtex®-4 FX field programmable gate array (FPGA) IC from AMD, supplied in a 672-ball FCBGA/BBGA package. It provides a combination of logic capacity, embedded memory, and I/O density suitable for industrial-grade embedded and control applications.

With 19,224 logic elements, approximately 1.25 Mbits of on-chip RAM and 320 I/O pins, this device supports complex logic integration while operating across an industrial temperature range. The device operates from a core voltage range of 1.14 V to 1.26 V and is RoHS compliant.

Key Features

  • Logic Capacity — 19,224 logic elements to implement substantial custom logic, control functions, and state machines within a single FPGA.
  • Embedded Memory — Approximately 1.25 Mbits of on-chip RAM for buffering, FIFOs, and local data storage to support datapath and control logic.
  • I/O Resources — 320 user I/O pins enabling broad external connectivity for sensors, actuators, peripherals, and high-density board-level interfaces.
  • Industrial Grade — Specified operating temperature range of −40 °C to 100 °C, suitable for industrial environments and temperature‑sensitive deployments.
  • Package and Mounting — 672-BBGA / 672-FCBGA package (27×27) with surface-mount mounting for compact, board-level integration.
  • Power Supply — Core voltage supply range of 1.14 V to 1.26 V to match system power-rail designs and regulator specifications.
  • Standards Compliance — RoHS compliant, supporting regulatory requirements for lead‑free manufacturing.

Typical Applications

  • Industrial Automation — Implement control logic, signal conditioning, and deterministic processing using the device’s logic and I/O resources within industrial systems.
  • Embedded Processing — Use the on-chip RAM and abundant logic elements for custom embedded datapaths, protocol handling, and peripheral aggregation.
  • I/O-Intensive Systems — Leverage 320 I/Os to interface with multiple sensors, actuators, and external devices on complex boards and modular systems.

Unique Advantages

  • Substantial Logic Density: 19,224 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
  • On-Chip Memory for Local Data Paths: Approximately 1.25 Mbits of embedded RAM supports buffering and low-latency data storage without external memory.
  • High I/O Count: 320 I/Os simplify system-level routing and permit direct connections to numerous peripherals and interfaces.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C to meet the thermal requirements of industrial deployments.
  • Compact BGA Packaging: 672-BBGA / 672-FCBGA (27×27) surface-mount package allows high-density PCB integration while maintaining robust soldered connections.
  • Regulatory Compliance: RoHS compliance eases adoption in modern manufacturing and supply chains.

Why Choose XC4VFX20-10FFG672I?

The XC4VFX20-10FFG672I is positioned for designers who need a balance of logic capacity, embedded memory and extensive I/O in an industrial-grade FPGA package. Its 19,224 logic elements, approximately 1.25 Mbits of on-chip RAM and 320 I/Os make it suitable for consolidating multiple functions and interfaces onto a single programmable device.

Supplied in a 672-ball FCBGA/BBGA surface-mount package and operating from −40 °C to 100 °C with a 1.14 V–1.26 V core supply range, this AMD Virtex®-4 FX FPGA offers a reliable building block for industrial embedded systems where integration, controllable power rails and RoHS compliance are required.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for XC4VFX20-10FFG672I.

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