XC4VFX20-10FFG672I
| Part Description |
Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 320 1253376 19224 672-BBGA, FCBGA |
|---|---|
| Quantity | 120 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 320 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2136 | Number of Logic Elements/Cells | 19224 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1253376 |
Overview of XC4VFX20-10FFG672I – Virtex®-4 FX Field Programmable Gate Array (672-FCBGA)
The XC4VFX20-10FFG672I is a Virtex®-4 FX field programmable gate array (FPGA) IC from AMD, supplied in a 672-ball FCBGA/BBGA package. It provides a combination of logic capacity, embedded memory, and I/O density suitable for industrial-grade embedded and control applications.
With 19,224 logic elements, approximately 1.25 Mbits of on-chip RAM and 320 I/O pins, this device supports complex logic integration while operating across an industrial temperature range. The device operates from a core voltage range of 1.14 V to 1.26 V and is RoHS compliant.
Key Features
- Logic Capacity — 19,224 logic elements to implement substantial custom logic, control functions, and state machines within a single FPGA.
- Embedded Memory — Approximately 1.25 Mbits of on-chip RAM for buffering, FIFOs, and local data storage to support datapath and control logic.
- I/O Resources — 320 user I/O pins enabling broad external connectivity for sensors, actuators, peripherals, and high-density board-level interfaces.
- Industrial Grade — Specified operating temperature range of −40 °C to 100 °C, suitable for industrial environments and temperature‑sensitive deployments.
- Package and Mounting — 672-BBGA / 672-FCBGA package (27×27) with surface-mount mounting for compact, board-level integration.
- Power Supply — Core voltage supply range of 1.14 V to 1.26 V to match system power-rail designs and regulator specifications.
- Standards Compliance — RoHS compliant, supporting regulatory requirements for lead‑free manufacturing.
Typical Applications
- Industrial Automation — Implement control logic, signal conditioning, and deterministic processing using the device’s logic and I/O resources within industrial systems.
- Embedded Processing — Use the on-chip RAM and abundant logic elements for custom embedded datapaths, protocol handling, and peripheral aggregation.
- I/O-Intensive Systems — Leverage 320 I/Os to interface with multiple sensors, actuators, and external devices on complex boards and modular systems.
Unique Advantages
- Substantial Logic Density: 19,224 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
- On-Chip Memory for Local Data Paths: Approximately 1.25 Mbits of embedded RAM supports buffering and low-latency data storage without external memory.
- High I/O Count: 320 I/Os simplify system-level routing and permit direct connections to numerous peripherals and interfaces.
- Industrial Temperature Range: Rated from −40 °C to 100 °C to meet the thermal requirements of industrial deployments.
- Compact BGA Packaging: 672-BBGA / 672-FCBGA (27×27) surface-mount package allows high-density PCB integration while maintaining robust soldered connections.
- Regulatory Compliance: RoHS compliance eases adoption in modern manufacturing and supply chains.
Why Choose XC4VFX20-10FFG672I?
The XC4VFX20-10FFG672I is positioned for designers who need a balance of logic capacity, embedded memory and extensive I/O in an industrial-grade FPGA package. Its 19,224 logic elements, approximately 1.25 Mbits of on-chip RAM and 320 I/Os make it suitable for consolidating multiple functions and interfaces onto a single programmable device.
Supplied in a 672-ball FCBGA/BBGA surface-mount package and operating from −40 °C to 100 °C with a 1.14 V–1.26 V core supply range, this AMD Virtex®-4 FX FPGA offers a reliable building block for industrial embedded systems where integration, controllable power rails and RoHS compliance are required.
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