XC4VFX20-11FF672I

IC FPGA 320 I/O 672FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 320 1253376 19224 672-BBGA, FCBGA

Quantity 777 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O320Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2136Number of Logic Elements/Cells19224
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1253376

Overview of XC4VFX20-11FF672I – Virtex®-4 FX Field Programmable Gate Array (672‑BBGA)

The XC4VFX20-11FF672I is a Virtex®-4 FX field programmable gate array from AMD supplied in a 672‑ball FCBGA (27×27) package. It combines reconfigurable logic, embedded RAM, and a broad I/O count in an industrial-grade FPGA intended for demanding embedded and industrial applications.

Key on‑device resources include 19,224 logic elements, approximately 1.25 Mbits of embedded memory, and 320 user I/O pins, delivering a compact, configurable platform for hardware acceleration and system integration within the specified voltage and temperature ranges.

Key Features

  • Reconfigurable Logic Capacity — 19,224 logic elements provide flexible, application‑specific hardware implementation for custom data paths and control logic.
  • Embedded Memory — Approximately 1.25 Mbits of on‑chip RAM for buffering, lookup tables, and state storage to support complex designs without external memory for some functions.
  • I/O Resources — 320 user I/O pins to support multiple external interfaces, peripheral connections, and parallel data paths.
  • Power Supply Range — Operates from 1.14 V to 1.26 V, enabling predictable power integration for supply design and sequencing.
  • Industrial Temperature Grade — Specified operating range of −40 °C to 100 °C for deployment in industrial and rugged environments.
  • Package and Mounting — 672‑BBGA FCBGA (27×27) surface‑mount package suitable for compact board designs while providing thermal and mechanical stability.
  • Regulatory Compliance — RoHS compliant, supporting environmental and end‑product regulatory considerations.

Typical Applications

  • Industrial Control and Automation — Reconfigurable logic and substantial I/O count enable motor control, programmable logic controllers, and sensor aggregation in industrial systems.
  • Embedded Processing and Hardware Acceleration — On‑chip memory and logic capacity support custom accelerators and offload functions from general‑purpose processors.
  • Communications and Interface Bridging — High I/O availability suits protocol conversion, parallel data handling, and custom interface implementations.

Unique Advantages

  • High Logic Density: 19,224 logic elements allow integration of complex functions directly in the FPGA fabric, reducing external component count.
  • Substantial On‑Chip Memory: Approximately 1.25 Mbits of embedded RAM helps minimize the need for external memory in many buffering and stateful tasks.
  • Ample I/O for System Integration: 320 user I/O pins provide flexibility to connect multiple peripherals, interfaces, and sensors without additional multiplexing.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in industrial environments and extended‑temperature deployments.
  • Compact BGA Package: 672‑ball FCBGA (27×27) enables dense PCB implementations while maintaining mechanical robustness and thermal performance.
  • RoHS Compliance: Meets environmental requirements for modern electronics manufacturing and product compliance.

Why Choose XC4VFX20-11FF672I?

XC4VFX20-11FF672I positions itself as a capable, industrial‑grade FPGA option for designers who need a balance of logic capacity, embedded memory, and extensive I/O in a compact BGA package. Its supply voltage window and specified operating temperature make it suitable for industrial embedded systems, communications interfaces, and hardware acceleration tasks where reconfigurable logic reduces system complexity.

This part is well suited to teams looking for a field‑programmable solution that combines integration and environmental robustness, enabling scalable designs supported by AMD's Virtex‑4 FX family characteristics.

Request a quote or submit a procurement inquiry to receive pricing, availability, and delivery information for XC4VFX20-11FF672I.

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