XC4VFX40-10FF1152I

IC FPGA 448 I/O 1152FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 448 2654208 41904 1152-BBGA, FCBGA

Quantity 566 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O448Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4656Number of Logic Elements/Cells41904
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2654208

Overview of XC4VFX40-10FF1152I – Virtex®-4 FX FPGA, 1152-FCBGA (Industrial)

The XC4VFX40-10FF1152I is a Virtex-4 FX field programmable gate array (FPGA) IC from AMD, supplied in a 1152-ball FCBGA package. It offers a combination of high logic capacity, on-chip embedded memory, and a large I/O count for demanding programmable-logic designs.

Designed and specified for industrial use, the device supports surface-mount assembly and operates across a wide temperature range, delivering a predictable platform for systems that require programmable logic, significant I/O, and embedded RAM resources.

Key Features

  • Logic Capacity 41,904 logic elements available for implementing custom digital logic and control functions.
  • Embedded Memory Approximately 2.65 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic.
  • I/O Density 448 user I/O pins to connect to peripherals, sensors, and high-density board-level interfaces.
  • Power Supply Core voltage supply range of 1.14 V to 1.26 V for the FPGA core domain.
  • Package and Mounting 1152-ball FCBGA / 1152-BBGA package (supplier device package: 1152-FCBGA, 35×35) with surface-mount mounting for compact board integration.
  • Industrial Temperature Range Rated to operate from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Regulatory Status RoHS compliant.

Unique Advantages

  • High logic capacity: 41,904 logic elements enable complex designs and sizable custom logic implementations without immediate need for multiple devices.
  • Significant on-chip RAM: Approximately 2.65 Mbits of embedded memory reduce dependence on external memory for many buffering and state-storage tasks.
  • Extensive I/O connectivity: 448 I/O pins provide flexibility for interfacing to a wide range of external components and system-level signals.
  • Industrial-grade operation: −40 °C to 100 °C operating range supports deployment in harsh or industrial environments.
  • Compact FCBGA package: 1152-ball FCBGA (35×35) supports high-density integration on modern PCB layouts while maintaining surface-mount assembly compatibility.
  • Manufacturer pedigree: Provided by AMD and offered in a RoHS-compliant form factor for regulated manufacturing requirements.

Why Choose XC4VFX40-10FF1152I?

The XC4VFX40-10FF1152I positions itself as a capable, industrial-grade FPGA option where substantial logic capacity, embedded memory, and large I/O counts are required in a single, surface-mount package. Its specified core voltage range and industrial temperature rating make it suitable for engineered systems that demand predictable electrical and thermal performance.

This device is suitable for designs that need a balance of programmable logic density, on-chip RAM, and board-level I/O without adding multiple components, helping reduce BOM complexity and easing system integration for industrial applications.

Request a quote or submit a purchase inquiry to obtain pricing, lead-time, and availability for the XC4VFX40-10FF1152I.

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