XC4VFX40-10FFG1152I

IC FPGA 448 I/O 1152FCBGA
Part Description

Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 448 2654208 41904 1152-BBGA, FCBGA

Quantity 800 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O448Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4656Number of Logic Elements/Cells41904
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2654208

Overview of XC4VFX40-10FFG1152I – Virtex®-4 FX Field Programmable Gate Array (FPGA), 1152-FCBGA

The XC4VFX40-10FFG1152I is a Virtex®-4 FX Field Programmable Gate Array (FPGA) IC from AMD supplied in a 1152-BBGA / 1152-FCBGA package. It delivers a high count of programmable logic and on-chip memory along with extensive I/O, making it suitable for industrial applications that require configurable hardware resources within a surface-mount, ball-grid package.

Key device attributes include 41,904 logic elements, approximately 2.65 Mbits of embedded memory, 448 I/O pins, a supply voltage range of 1.14 V to 1.26 V, and an industrial operating temperature range from −40 °C to 100 °C.

Key Features

  • Programmable Logic  Provides 41,904 logic elements for implementing custom digital logic, control paths, and data processing blocks.
  • Embedded Memory  Approximately 2.65 Mbits of on-chip RAM available for buffering, look-up tables, and intermediate data storage.
  • High I/O Count  448 I/O pins support complex connectivity and multiple external interfaces in a single device.
  • Package and Mounting  1152-BBGA / 1152-FCBGA device package (1152-FCBGA (35x35)) in a surface-mount form factor for compact board integration.
  • Power  Operates from a supply voltage range of 1.14 V to 1.26 V to match system power rails.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
  • Manufacturer  Produced by AMD with documentation available in the component datasheet for design reference.

Typical Applications

  • Industrial Control and Automation  Programmable logic and embedded memory support custom control algorithms, sensor interfacing, and deterministic I/O handling in industrial systems.
  • Communications and Networking Equipment  High logic density and large I/O count enable protocol processing, data buffering, and custom packet handling functions.
  • High‑Density Embedded Systems  Combines substantial on-chip RAM and logic capacity for compact embedded designs that require configurable hardware acceleration.
  • Prototyping and Custom IP Development  Offers a platform for developing and validating custom IP blocks and FPGA-based proofs of concept within a surface-mount package.

Unique Advantages

  • Large Logic Resource: 41,904 logic elements allow implementation of complex, multi-function designs without immediate board-level expansion.
  • Significant On‑Chip Memory: Approximately 2.65 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT requirements.
  • Extensive I/O: 448 I/O pins accommodate multiple external interfaces and parallel connections within a single device.
  • Industrial Rating: Specified operation from −40 °C to 100 °C supports deployment in a wide range of industrial environments.
  • Compact FCBGA Package: 1152-FCBGA (35x35) surface-mount package enables high-density PCB integration while maintaining thermal and mechanical stability.
  • Tight Power Range: 1.14 V to 1.26 V supply window simplifies power-system design for compatible voltage rails.

Why Choose XC4VFX40-10FFG1152I?

The XC4VFX40-10FFG1152I positions itself as a configurable, industrial-grade FPGA option that brings together substantial logic capacity, on-chip memory, and a high pin count in a compact FCBGA package. It is well suited to engineers designing industrial control systems, communications gear, and dense embedded platforms that require flexible hardware implementation within a surface-mount footprint.

By combining AMD manufacturing and documented device specifications, the part supports designs that demand scalable programmable resources, reliable operation across a broad temperature range, and clear electrical requirements for integration into production systems.

Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for the XC4VFX40-10FFG1152I.

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